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Obstacles for low-temperature dislocation motion in polycrystalline zinc

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Abstract

The thermally activated plastic flow of zinc has been investigated by means of differential-stress creep tests at 87°K and tensile tests in the temperature range 87° to 475°K. The thermal activation enthalpy as a function of stress and the total activation enthalpy (1.1 ev) have been obtained. The activation area is found to decrease with stress from about 800b2 at zero effective stress to a constant value of 75b2. The rate-controlling obstacle for low temperature deformation is identified to be the “forest” dislocation. The approximate stacking fault width and stacking fault energy in zinc are deduced to be “3.5b” and 75 erg per sq cm, respectively.

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Authors and Affiliations

  1. Materials Research Group, Department of Metallurgy, Indian Institute of Science, Bangalore, India

    D. H. Sastry (Lecturer), Y. V. R. K. Prasad (Lecturer) & K. I. Vasu (Assistant Professor)

Authors
  1. D. H. Sastry
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  2. Y. V. R. K. Prasad
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  3. K. I. Vasu
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Sastry, D.H., Prasad, Y.V.R.K. & Vasu, K.I. Obstacles for low-temperature dislocation motion in polycrystalline zinc. Metall Trans 1, 1827–1831 (1970). https://doi.org/10.1007/BF02642778

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  • DOI: https://doi.org/10.1007/BF02642778

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