Abstract
Diffusion induced grain boundary migration (DIGM) was observed to occur in a Ni-48.5 wt pct Cu alloy during oxidation at 450 °C, 500 °C, 600 °C, and 707 °C in air. The DIGM zones are Cu enriched. A Ni depleted zone, consisting of small recrystallized grains, formed in the matrix beneath the metal-oxide interface during oxidation at 600 °C and 707 °C. This process is referred to as oxidation-induced recrystallization (OIR). Growth of the small OIR grains was observed to be associated with Cu-rich DIGM. No Cu-rich DIGM was found in the same alloy when annealed in Ar at 707 °C. Oxidation of this alloy in air resulted in the formation of a duplex oxide: an inner NiO layer and an outer CuO layer. The NiO layer was observed to grow at a faster rate than the CuO layer. The occurrence of Cu-rich DIGM is interpreted in terms of this preferential oxidation of Ni.
Similar content being viewed by others
References
M. Hillert and G. R. Purdy:Acta Metall., 1978, vol. 26, pp. 333–40.
R.W. Balluffi and J.W. Cahn:Acta Metall., 1981, vol. 29, pp. 493–500.
D.A. Smith and A. H. King:Phil. Mag., 1981, vol. A44, pp. 333–40.
P.G. Shewmon:Acta Metall., 1981, vol. 29, pp. 1567–72.
P.G. Shewmon and G. Meyrick:Diffusion in Solids: Recent Developments, M. A. Dayanada and G. E. Murch, eds., 1985, AIME, pp. 261-73.
F. J. A. den Breeder:Acta Metall., 1972, vol. 20, pp. 319–32.
J.W. Cahn, J.D. Pan, and R. W. Balluffi:Scripta Metall., 1979, vol. 13, pp. 503–09.
F. J. A. den Breeder and S. Nakahara:Scripta Metall., 1983, vol. 17, pp. 399–404.
Chongmo Li and M. Hillert:Acta Metall., 1982, vol. 30, pp. 1133–46.
K.N. Tu:J. Appl. Phys., 1977, vol. 48, pp. 3400–04.
S. Nakahara and F. J. A. den Breeder:Scripta Metall., 1983, vol. 17, pp. 607–10.
S.A. Hackney, F. S. Biancaniello, D.N. Yoon, and C.A. Handwerker:Scripta Metall., 1986, vol. 20, pp. 937–42.
D. Liu, W. A. Miller, and K.T. Aust: Int. Conf. “Interface Science and Engineering 87”, Lake Placid, NY, July 1987,Journal de Physique, in press.
D.P. Whittle and G.C. Wood:J. Inst. Metals, 1969, vol. 96, pp. 115–23.
D.P. Whittle and G.C. Wood:Corrosion Sci., 1968, vol. 8, pp. 295–308.
K. Heinemann, D. B. Rao, and D. L. Douglass:Oxidation of Metals, 1977, vol. 11, no. 6, pp. 321–34.
D. Liu, W. A. Miller, and K. T. Aust:Scripta Metall., 1987, vol. 21, pp. 643–47.
J. A. Sartell, S. Bendel, T. L. Johnson, and C. H. Li:Trans. ASM, 1957, vol. 50, pp. 1047–62.
F.N. Rhines and J.S. Wolf:Metall. Trans., 1970, vol. 1, pp. 1701–10.
F.N. Rhines and R. Connell:J. Electrochem. Soc., 1977, vol. 124, pp. 1122–28.
M. Seo, G. Hultquist, F. Baba, and N. Sato:Oxidation of Metals, 1986, vol. 25, no. 3/4, pp. 163–74.
E.T. Turkdogan:Physical Chemistry of High Temperature Technology, Academic Press, New York, NY, 1980, p. 10.
G. Hultquist, M. Seo, and N. Sato:Oxidation of Metals, 1986, vol. 25, pp. 363–72.
D. D. Dankov and P. V. Churaev:Dokl. Akad Nauk U.S.S.R., 1950, vol. 73, pp. 1221–24.
H. Engell and F. Wever:Acta Metall., 1957, vol. 5, pp. 695–702.
N.B. Pilling and R.E. Bedworth:J. Inst. Metals, 1923, vol. 29, pp. 529–91.
M.I. Manning:Corrosion Sci., 1981, vol. 21, pp. 301–16.
C.R.M. Grovenor:Acta Metall., 1985, vol. 33, pp. 579–86.
G. Meyrick, V. S. Iyer, and P.G. Shewmon:Acta Metall., 1985, vol. 33, pp. 273–79.
C. R. M. Grovenor, D. A. Smith, and M. J. Goringe:Thin Solid Films, 1980, vol. 74, pp. 257–79.
C. A. Handwerker: inDiffusion in Thin Films, D. Gupta, ed., Noyes Publication, in press.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Liu, D., Miller, W.A. & Aust, K.T. Diffusion induced grain boundary migration and recrystallization during oxidation of a Ni- 48.5 Pet Cu alloy. Metall Trans A 19, 1667–1675 (1988). https://doi.org/10.1007/BF02645134
Received:
Issue Date:
DOI: https://doi.org/10.1007/BF02645134