Abstract
A silver-based active (titanium-containing) brazing alloy, namely 63Ag-34.25Cu-1.75Ti-1.OSn, was found to serve as a totally metal (no glass) thick film conductor which exhibited lower electrical resistivity, much greater film/substrate adhesion, much lower porosity, similar solderability, and lower scratch resistance compared to the conventional silver-glass thick film. The brazing alloy film was formed by screen printing a paste containing the alloy particles and then firing at 880°C in vacuum.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
ReneE. Cote and Robert J. Bouchard,Electronic Ceramics, ed. Lionel M. Levinson, (New York: Marcel Dekker, Inc., 1988), Ch. 6, p. 307.
Howard Mizuhara and Toshi Ogama,ASM Handbook, Vol. 4 (Ceramics and Glasses).
W. Weise, W. Malikowski and W. Bohm,Ceramic Ind. 134 (2), 38 (1990).
Method of Test for Wire Peel Adhesion of Soldered Thick Film Conductors to Ceramic Substrates, DuPont Electronics.
Standard Practice for Determining Solderability of Thick Film Conductors, ASTM Designation: F357-78 (Reapproved 1991).
Shear I Scratch Tester Manual, Teledyne Taber Inc.
Metz Brazing Products for Quality Metal Joining Product Catalogue, Degussa.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Zhu, M., Chung, D.D.L. Active brazing alloy paste as a totally metal thick film conductor material. J. Electron. Mater. 23, 541–549 (1994). https://doi.org/10.1007/BF02670657
Received:
Revised:
Issue Date:
DOI: https://doi.org/10.1007/BF02670657