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Diffusion soldering for stable high-temperature thin-film bonds

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Abstract

Diffusion soldering is a special bonding technique to produce joints at a moderate temperature that are subsequently stable at higher temperatures. The search for material systems extending the upper-temperature limit of stability requires information from the pertinent phase diagrams and the reaction kinetics. Combining experimental studies on phase equilibration in powder samples with bulk and thin-film diffusion couples is a useful approach for a systematic search. Promising candidates for dsoldering are Pt-In or Pd-In, and molybdenum is also an effective diffusion barrier against the attack of liquid tin.

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Authors and Affiliations

  1. Institute of Metallurgy, Technical University of Clausthal, Robert-Koch-Str. 42, D-38678, Clausthal Zellerfeld, Germany

    Thomas Studnitzky Ph.D. candidate & Rainer Schmid-Fetzer (professor)

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  1. Thomas Studnitzky Ph.D. candidate
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  2. Rainer Schmid-Fetzer
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Studnitzky, T., Schmid-Fetzer, R. Diffusion soldering for stable high-temperature thin-film bonds. JOM 54, 58–63 (2002). https://doi.org/10.1007/BF02709191

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