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The past, present, and future of multilayer ceramic multichip modules in electronic packaging

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References

  1. E.J. Rymaszewski, J.L. Walsh, and G.W. Leehan, “Semiconductor Logic Technology in IBM,” IBM J. of Res. and Develop., 25(9) (1981), pp. 603–611.

    Google Scholar 

  2. R.R. Tummala and E.J. Rymaszewski, Microelectronic Packaging (New York: Van Nostrand Reinhold, 1989), pp. 11–164.

    Google Scholar 

  3. A.J. Blodgett and D.R. Barbour, “Thermal Conduction Module-A High Performance Multilayer Ceramic,” IBM J. Res. and Develop., 26 (1982), pp. 30–36.

    Google Scholar 

  4. D. Barbour, “Multichip Module Technology,” Multilayer Ceramic Devices, vol. 19, ed. J.R. Blum and R.J. Canion (Westerville, OH: American Ceramic Society, 1986), pp. 1530.

    Google Scholar 

  5. W.S. Young, “Multilayer Ceramic Technology,” Ceramic Materials in Electronics, ed. R.C. Buchanan (New York: Marcell Dekker Inc., 1986), pp. 403–424.

    Google Scholar 

  6. A.H. Kumar and R.R. Tummala, “State-of-the-Art, Glass-Ceramic/Copper, Multilayer Substrate for High Performance Computers,” Intl. J. Hybrid Microelectronics, 14(4) (December 1991), pp. 137–150.

    Google Scholar 

  7. K. Niwa et al., “Multilayer Ceramic Circuit Board with Copper Conductor,” Multilayer Ceramic Devices, vol. 19, ed. J.R. Blum and R. Canion (Westerville, OH: American Ceramic Society, 1986), pp. 41–48.

    Google Scholar 

  8. R.N. Master, L.W. Herron, and R.R. Tummala, “Cofiring Process for Glass-Ceramic/Copper Multilayer Ceramic Substrates,” Proc. 41st. Electronic Component and Technology Conference (New York: IEEE, 1991), pp. 5–9.

    Google Scholar 

  9. T. Kurihara et al. “Mullite Ceramic Substrate for Thin Film Application,” Proc. 40th. Electronics Components and Technology Conference (New York: IEEE, 1990), p. 68.

    Google Scholar 

  10. Y. Shimada et al., “Large, Multilayer Glass-Ceramic Substrate for Supercomputers,” Proc. 40th. Electronic Component and Technology Conference (New York: IEEE, 1990), p. 76.

    Google Scholar 

  11. A. Kaneko, K. Seyama, and M. Suzuki, “LSI Packaging and Cooling Technology of Fujitsu VP-2000,” Fujitsu, 41(1) (1990), p. 12.

    Google Scholar 

  12. Y. Shimada et al., “High Speed Computer Packaging with Multilayer Glass-Ceramic Substrates,” ISHM’91 Proceedings (Reston, VA: Intl. Society for Hybrid Microelectronics, 1991), pp. 176–182.

    Google Scholar 

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Authors and Affiliations

  1. First Level Packaging Laboratory, IBM Technology Products, East Fishkill, New York, USA

    Ananda H. Kumar Ph.D. (senior technical staff member) & Rao R. Tummala Ph.D. (IBM fellow)

Authors
  1. Ananda H. Kumar Ph.D.
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  2. Rao R. Tummala Ph.D.
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Kumar, A.H., Tummala, R.R. The past, present, and future of multilayer ceramic multichip modules in electronic packaging. JOM 44, 10–14 (1992). https://doi.org/10.1007/BF03222269

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