1 Introduction
2 Materials and methods
2.1 Board manufacturing
Material | UF-resin content (%) | Target thickness (mm) | Target density (g/cm3) | Press time (s/mm) | Press temperature (°C) | Percentage of annual plant in combination with wood (middle layer) (%) | |
---|---|---|---|---|---|---|---|
ML | SL | ||||||
1. industrial wood chips | 8 | 10 | 20 | 0.7 | 15 | 200 | 90, 80, 70, 50, 0 |
2. bagasse | 8 | 10 | 20 | 0.7 | 15 | 200 | 10, 20, 30, 50, 100 |
3. canola chips | 8 | 10 | 20 | 0.7 | 15 | 200 | 10, 20, 30, 50, 100 |
4. hemp sheaves | 8 | 10 | 20 | 0.7 | 15 | 200 | 10, 20, 30, 50, 100 |
2.2 Preparation of materials
2.3 Sample preparation and testing mechanical-technical properties of the particle boards
Test | Sample size [mm] | Number of samples for each series |
---|---|---|
Bending MOE/MOR | 50×360×20 | 9 / 9 |
Internal Bond (IB) Strength | 50×50×20 | 24 |
Thickness Swelling (TS) | 50×50×20 | 24 |
Water absorbance | 50×50×20 | 24 |