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Determination of thermal conductivities of Sn–Zn lead-free solder alloys with radial heat flow and Bridgman-type apparatus

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Abstract

The variations of thermal conductivities of solid phases versus temperature for pure Sn, pure Zn and Sn–9 wt.% Zn, Sn–14 wt.% Zn, Sn–50 wt.% Zn, Sn–80 wt.% Zn binary alloys were measured with a radial heat flow apparatus. The thermal conductivity ratios of liquid phase to solid phase for the pure Sn, pure Zn and eutectic Sn–9 wt.% Zn alloy at their melting temperature are found with a Bridgman-type directional solidification apparatus. Thus, the thermal conductivities of liquid phases for pure Sn, pure Zn and eutectic Sn–9 wt.% Zn binary alloy at their melting temperature were evaluated by using the values of solid phase thermal conductivities and the thermal conductivity ratios of liquid phase to solid phase.

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Authors and Affiliations

  1. Department of Metallurgy and Materials Engineering, Faculty of Engineering, Karabük University, 78050, Karabük, Turkey

    Fatma Meydaneri

  2. Department of Physics, Faculty of Arts and Sciences, Erciyes University, 38039, Kayseri, Turkey

    Buket Saatçi & Mehmet Gündüz

  3. Department of Chemistry, Faculty of Arts and Sciences, Erciyes University, 38039, Kayseri, Turkey

    Mehmet Özdemir

Authors
  1. Fatma Meydaneri
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  2. Buket Saatçi
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  3. Mehmet Gündüz
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  4. Mehmet Özdemir
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Correspondence to Fatma Meydaneri.

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Communicated by Andreas Öchsner.

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Meydaneri, F., Saatçi, B., Gündüz, M. et al. Determination of thermal conductivities of Sn–Zn lead-free solder alloys with radial heat flow and Bridgman-type apparatus. Continuum Mech. Thermodyn. 25, 691–704 (2013). https://doi.org/10.1007/s00161-012-0263-8

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  • DOI: https://doi.org/10.1007/s00161-012-0263-8

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