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Rheologica Acta

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01.03.2014 | Original Contribution

Relationship between rheological and electrical percolation in a polymer nanocomposite with semiconductor inclusions

verfasst von: Ahmad Zohrevand, Abdellah Ajji, Frej Mighri

Erschienen in: Rheologica Acta | Ausgabe 3/2014

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Abstract

Microstructure, electrical conductivity, and rheological properties of nanocomposites based on isotactic polypropylene (iPP) containing semiconductor nanoparticles of TiO₂ were studied. Compatibilized and uncompatibilized nanocomposites containing a wide range of TiO₂ concentrations (up to 15 vol%) were prepared by melt compounding in a twin-screw extruder via a masterbatch method. An anhydride-modified PP (AMPP) was used as the compatibilizer. Atomic force microscopy (AFM), scanning electron microscopy (SEM), and image analysis techniques were utilized to study the morphology evolution in the samples. Analyzing the results of direct current (DC) electrical conductivity measurements showed a lower percolation threshold for the uncompatibilized samples, compared to the compatibilized ones. In order to estimate the percolation threshold, linear and nonlinear melt-state viscoelastic properties of the samples were studied. Liquid-solid transition and nonterminal behavior of the uncompatibilized samples were observed at relatively lower range of TiO₂ loading, compared to the compatibilized samples. It was an indication of lower rheological percolation threshold in the uncompatibilized nanocomposites which was in agreement with the electrical percolation threshold. Scaling analysis of strain sweep tests above the percolation thresholds of the nanocomposites resulted in a lower fractal dimension for the uncompatibilized samples.

Vorheriger Artikel A new fractional derivative model for linearly viscoelastic materials and parameter identification via genetic algorithms

Nächster Artikel Rheological properties of starch suspensions using a rotational rheometer fitted with a starch stirrer cell

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Titel: Relationship between rheological and electrical percolation in a polymer nanocomposite with semiconductor inclusions
verfasst von: Ahmad Zohrevand
Abdellah Ajji
Frej Mighri
Publikationsdatum: 01.03.2014
Verlag: Springer Berlin Heidelberg
Erschienen in: Rheologica Acta / Ausgabe 3/2014
Print ISSN: 0035-4511
Elektronische ISSN: 1435-1528
DOI: https://doi.org/10.1007/s00397-013-0750-2

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