Skip to main content
Erschienen in: Microsystem Technologies 12/2012

01.12.2012 | Technical Paper

Enhancement of bonding strength of packaging based on BCB bonding for RF devices

verfasst von: Seonho Seok, Michel Fryziel, Nathalie Rolland, Paul-Alain Rolland

Erschienen in: Microsystem Technologies | Ausgabe 12/2012

Einloggen

Aktivieren Sie unsere intelligente Suche um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

This paper presents a Si cap zero-level packaging technique based on a double-layer BCB sealing ring. The BCB ring is defined before the housing cavity etching to achieve high BCB bonding strength. It is found that the non-uniformity of the BCB ring defined on a Si cap with housing cavity prevents the package having high bonding strength. Three different packages have been prepared for shear test; a Si cap without cavity, a recessed Si cap with a conventional BCB ring and a recessed Si cap with pre-defined BCB ring. The three samples for each type of package are measured. The average measured bonding strengths of the test samples are 71, 16 and 42 MPa, respectively, and hence the proposed BCB sealing ring process provides 60 % of bonding strength of Si cap package without cavity for Si cap package with cavity. In addition, the insertion loss change of the packaged CPW is less than 0.1 dB up to 67 GHz while the return loss better than 15 dB at the measured frequency range.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literatur
Zurück zum Zitat Ida Y, Garrou PE, Strandjord AJG, Cummings SL, Rogers WB, Berry MJ, Kisting SR (1995) Processing, transfer solder bumping, chip attachment and testing of a thin film Cu/Photo-BCB MCM-D. In: Proceedings of the 18th IEEE/CPMT international electronic manufacturing technology symposium, 4–6 Dec 1995, Japan, pp 441–444 Ida Y, Garrou PE, Strandjord AJG, Cummings SL, Rogers WB, Berry MJ, Kisting SR (1995) Processing, transfer solder bumping, chip attachment and testing of a thin film Cu/Photo-BCB MCM-D. In: Proceedings of the 18th IEEE/CPMT international electronic manufacturing technology symposium, 4–6 Dec 1995, Japan, pp 441–444
Zurück zum Zitat Jourdain A, Moore PD, Baert K, Wolf ID, Tilmans HAC (2005) Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-) MEMS devices. J Micromech Microeng 15(7):89–96CrossRef Jourdain A, Moore PD, Baert K, Wolf ID, Tilmans HAC (2005) Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-) MEMS devices. J Micromech Microeng 15(7):89–96CrossRef
Zurück zum Zitat Oberhammer J, Niklaus F, Stemme G (2004) Sealing of adhesive bonded devices on wafer level. Sens Actuators A Phys 110:407–412CrossRef Oberhammer J, Niklaus F, Stemme G (2004) Sealing of adhesive bonded devices on wafer level. Sens Actuators A Phys 110:407–412CrossRef
Zurück zum Zitat Seok S, Rolland N, Rolland PA (2006) Packaging methodology for RF devices using a BCB membrane transfer technique. J Micromech Microeng 16(11):2384–2388CrossRef Seok S, Rolland N, Rolland PA (2006) Packaging methodology for RF devices using a BCB membrane transfer technique. J Micromech Microeng 16(11):2384–2388CrossRef
Zurück zum Zitat Seok S, Rolland N, Rolland PA (2008) A novel packaging method using wafer-level BCB polymer bonding and glass wet-etching for RF Applications. Sens Actuators A Phys 147(2):677–682CrossRef Seok S, Rolland N, Rolland PA (2008) A novel packaging method using wafer-level BCB polymer bonding and glass wet-etching for RF Applications. Sens Actuators A Phys 147(2):677–682CrossRef
Zurück zum Zitat Tilmans HAC, Ziad H, Jansen H, Monaco OD, Jourdain A (2001) Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab. IEEE International Electron Devices Meeting, 2001, pp 921–924 Tilmans HAC, Ziad H, Jansen H, Monaco OD, Jourdain A (2001) Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab. IEEE International Electron Devices Meeting, 2001, pp 921–924
Metadaten
Titel
Enhancement of bonding strength of packaging based on BCB bonding for RF devices
verfasst von
Seonho Seok
Michel Fryziel
Nathalie Rolland
Paul-Alain Rolland
Publikationsdatum
01.12.2012
Verlag
Springer-Verlag
Erschienen in
Microsystem Technologies / Ausgabe 12/2012
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-012-1530-0

Weitere Artikel der Ausgabe 12/2012

Microsystem Technologies 12/2012 Zur Ausgabe

Neuer Inhalt