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Erschienen in: Microsystem Technologies 3/2016

05.06.2015 | Technical Paper

Reliability characterization of a soot particle sensor in terms of stress- and electromigration in thin-film platinum

verfasst von: Radoslav Rusanov, Holger Rank, Tino Fuchs, Roland Mueller-Fiedler, Oliver Kraft

Erschienen in: Microsystem Technologies | Ausgabe 3/2016

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Abstract

In this work we present a systematic investigation of various failure mechanisms for thin-film platinum heater structures and interdigitated electrodes as components of a resistive type soot particle sensor. We study the role of stress-migration and electromigration and their interaction for the reliability of these sensors. The influence of a titanium adhesion layer and gases from the ambient atmosphere are also studied. Lifetime determination and optical and scanning electron microscopy are applied for samples which have experienced different load conditions to understand qualitatively and quantitatively the phenomena. The aim of this work is to enable time-to-failure prediction and thus provide guidelines for limiting temperature and current density in the actual sensor to ensure its stability over lifetime. We use dedicated, application-related test structures to ensure that the results are applicable to sensor lifetime estimations.

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Literatur
Zurück zum Zitat Black JR (1969) Electromigration failure modes in aluminum metallization for semiconductor devices. Proc IEEE 57(9):1587–1594CrossRef Black JR (1969) Electromigration failure modes in aluminum metallization for semiconductor devices. Proc IEEE 57(9):1587–1594CrossRef
Zurück zum Zitat Courbat J, Briand D, de Rooij NF (2008) Reliability improvement of suspended platinum-based micro-heating elements. Sens Actuators A 142:284–291CrossRef Courbat J, Briand D, de Rooij NF (2008) Reliability improvement of suspended platinum-based micro-heating elements. Sens Actuators A 142:284–291CrossRef
Zurück zum Zitat Daves W (2013) Silicon carbide field-effect transistor (FET) transducers for harsh environment Applications. Shaker Verlag, p 59. ISBN 978-3-8440-1681-9 Daves W (2013) Silicon carbide field-effect transistor (FET) transducers for harsh environment Applications. Shaker Verlag, p 59. ISBN 978-3-8440-1681-9
Zurück zum Zitat Firebaugh SL, Jensen KF, Schmidt MA (1998) Investigation of high-temperature degradation of platinum thin films with an in situ resistance measurement apparatus. J Micro Electro Mech Syst 7(1):128–135CrossRef Firebaugh SL, Jensen KF, Schmidt MA (1998) Investigation of high-temperature degradation of platinum thin films with an in situ resistance measurement apparatus. J Micro Electro Mech Syst 7(1):128–135CrossRef
Zurück zum Zitat Garraud A, Combette P, Giani A (2013) Thermal stability of Pt/Cr and Pt/Cr2O3 thin-film layers on a SiNx/Si substrate for thermal sensor applications. Thin Solid Films 540:256–260CrossRef Garraud A, Combette P, Giani A (2013) Thermal stability of Pt/Cr and Pt/Cr2O3 thin-film layers on a SiNx/Si substrate for thermal sensor applications. Thin Solid Films 540:256–260CrossRef
Zurück zum Zitat Hu C-K, Lee KY, Gignac L, Carruthers R (1997) Electromigration in 0.25 mm wide Cu line on W. Thin Solid Films 308–309:443–447CrossRef Hu C-K, Lee KY, Gignac L, Carruthers R (1997) Electromigration in 0.25 mm wide Cu line on W. Thin Solid Films 308–309:443–447CrossRef
Zurück zum Zitat Hyun S, Kraft O, Vinci RP (2004) Mechanical behavior of Pt and Pt-Ru solid solution alloy thin films. Acta Mater 52:4199–4211CrossRef Hyun S, Kraft O, Vinci RP (2004) Mechanical behavior of Pt and Pt-Ru solid solution alloy thin films. Acta Mater 52:4199–4211CrossRef
Zurück zum Zitat Johnson TV (2010) Review of diesel emissions and control. SAE Int J Fuels Lubr 3(1):16–29CrossRef Johnson TV (2010) Review of diesel emissions and control. SAE Int J Fuels Lubr 3(1):16–29CrossRef
Zurück zum Zitat Laermer F, Schilp A (1996) Method of anisotropically etching silicon. United States Patent no. 5501893 Laermer F, Schilp A (1996) Method of anisotropically etching silicon. United States Patent no. 5501893
Zurück zum Zitat Park JH, Ahn BT (2003) Electromigration model for the prediction of lifetime based on the failure unit statistics in aluminum metallization. J Appl Phys 93(2):883–892CrossRef Park JH, Ahn BT (2003) Electromigration model for the prediction of lifetime based on the failure unit statistics in aluminum metallization. J Appl Phys 93(2):883–892CrossRef
Zurück zum Zitat Seah MP (1980) The quantitative analysis of surfaces by XPS: a review. Surf Interface Anal 2(6):222–239CrossRef Seah MP (1980) The quantitative analysis of surfaces by XPS: a review. Surf Interface Anal 2(6):222–239CrossRef
Zurück zum Zitat Spannhake J, Schulz O, Helwig A, Krenkow A, Mueller G, Doll T (2006) High-temperature MEMS heater platforms: long-term performance of metal and semiconductor heater materials. Sensors 6:405–419CrossRef Spannhake J, Schulz O, Helwig A, Krenkow A, Mueller G, Doll T (2006) High-temperature MEMS heater platforms: long-term performance of metal and semiconductor heater materials. Sensors 6:405–419CrossRef
Zurück zum Zitat Stapelberg RF (2009) Handbook of reliability, availability, maintainability and safety. Springer, Berlin, p 201MATH Stapelberg RF (2009) Handbook of reliability, availability, maintainability and safety. Springer, Berlin, p 201MATH
Zurück zum Zitat Tao J, Cheung NW, Hu C (1993) Electromigration characteristics of copper interconnects. IEEE Electron Device Lett 14(5):249–251CrossRef Tao J, Cheung NW, Hu C (1993) Electromigration characteristics of copper interconnects. IEEE Electron Device Lett 14(5):249–251CrossRef
Zurück zum Zitat Thompson CV (1990) Grain growth in thin films. Annu Rev Mater Sci 20:245–268CrossRef Thompson CV (1990) Grain growth in thin films. Annu Rev Mater Sci 20:245–268CrossRef
Metadaten
Titel
Reliability characterization of a soot particle sensor in terms of stress- and electromigration in thin-film platinum
verfasst von
Radoslav Rusanov
Holger Rank
Tino Fuchs
Roland Mueller-Fiedler
Oliver Kraft
Publikationsdatum
05.06.2015
Verlag
Springer Berlin Heidelberg
Erschienen in
Microsystem Technologies / Ausgabe 3/2016
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-015-2576-6

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