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Microsystem Technologies
Erschienen in: Microsystem Technologies 5/2017

28.03.2017 | Review Paper

Depth-sensing nanoindentation measurement techniques and applications

verfasst von: Bharat Bhushan

Erschienen in: Microsystem Technologies | Ausgabe 5/2017

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Abstract

To measure nanomechanical properties of surface layers of bulk materials and thin films, depth-sensing nanoindentation measurement techniques are used commonly. The nanoindentation apparatus continuously monitors the load and the position of the indenter relative to the surface of the specimen (depth of an indent or displacement) during the indentation process. Indentation experiments can be performed at a penetration depth of as low as about 5 nm. This paper presents an overview of various nanoindentation techniques, various measurement options, and data analysis. Data on elastic–plastic deformation behavior, hardness, elastic modulus, scratch resistance, film-substrate adhesion, residual stresses, time-dependent creep and relaxation properties, fracture toughness, and fatigue are presented.
Vorheriger Artikel Two-dimensional spin coating technology and the effect of artificial gravity on film’s air-bubbling

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Metadaten
Titel
Depth-sensing nanoindentation measurement techniques and applications
verfasst von
Bharat Bhushan
Publikationsdatum
28.03.2017
Verlag
Springer Berlin Heidelberg
Erschienen in
Microsystem Technologies / Ausgabe 5/2017
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-017-3372-2

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