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Changes in surface stress of gold electrode during underpotential deposition of copper

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Abstract

The changes in surface stress of the evaporated gold electrode (mainly oriented to the (111) plane) during underpotential deposition (UPD) of copper in 0.1 M sulfuric acid medium or 0.1 M perchloric acid medium with and without sulfate or chloride were measured using a bending beam method. The surface stress maximum of gold electrode appeared during Cu-UPD. The co-adsorption of (bi)sulfate or chloride ions with copper atoms induced the compressive surface stress to promote the Cu-UPD. The factors influencing the surface stress or surface elastic strain were discussed in relation to the Cu-UPD structure.

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Authors and Affiliations

  1. Graduate School of Engineering, Hokkaido University, Kita-13 Jo, Nishi-8 Chome, Kita-ku, Sapporo, 060-8628, Japan

    Masahiro Seo & Makiko Yamazaki

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  1. Masahiro Seo
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  2. Makiko Yamazaki
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Correspondence to Masahiro Seo.

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Dedicated to Professor Su-Il Pyun on the occasion of his 65th birthday.

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Seo, M., Yamazaki, M. Changes in surface stress of gold electrode during underpotential deposition of copper. J Solid State Electrochem 11, 1365–1373 (2007). https://doi.org/10.1007/s10008-007-0294-4

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  • DOI: https://doi.org/10.1007/s10008-007-0294-4

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