Abstract
Electrodeposition of copper by pulsating overpotential (PO) regime in the range of hydrogen co-deposition was examined by scanning electron microscopy. It was found that the increase of the pause-to-pulse ratio produced a strong effect on the morphology of electrodeposited copper. Honeycomb-like copper structures were formed with the pause-to-pulse ratios up to 5. Up to this value of the pause-to-pulse ratio, the diameter of the holes formed by attached hydrogen bubbles was decreasing, while their number was increasing by the application of PO regime. The compactness of the formed honeycomb-like structures was also increasing with the increasing pause duration. The increase of the pause-to-pulse ratio suppressed a coalescence of neighboring hydrogen bubbles. Copper dendrites in the interior of the holes and at their shoulders were formed with the higher pause-to-pulse ratios. The size of the formed dendrites, as well as their number, increased with the increasing pause duration. Depth of holes was decreasing with the increasing pause duration. The increased compactness of the obtained structures was explained by the use of a set of equations describing the effect of square-wave PO on electrodeposition process.
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References
Shin HC, Dong J, Liu M (2003) Adv Mater 15:1610. doi:10.1002/adma.200305160
Shin HC, Liu M (2004) Chem Mater 16:5460. doi:10.1021/cm048887b
Nikolić ND, Popov KI, Pavlović LjJ, Pavlović MG (2006) J Electroanal Chem 588:88. doi:10.1016/j.jelechem.2005.12.006
Nikolić ND, Popov KI, Pavlović LjJ, Pavlović MG (2006) Surf Coat Technol 201:560. doi:10.1016/j.surfcoat.2005.12.004
Nikolić ND, Popov KI, Pavlović LjJ, Pavlović MG (2007) J Solid State Electrochem 11:667. doi:10.1007/s10008-006-0222-z
Nikolić ND, Pavlović LjJ, Pavlović MG, Popov KI (2007) Electrochim Acta 52:8096. doi:10.1016/j.electacta.2007.07.008
Nikolić ND, Popov KI, Pavlović LjJ, Pavlović MG (2007) Sensors 7:1. doi:10.3390/s7010001
Nikolić ND, Pavlović LjJ, Krstić SB, Pavlović MG, Popov KI (2008) Chem Eng Sci 63:2824. doi:10.1016/j.ces.2008.02.022
Nikolić ND, Branković G, Pavlović MG, Popov KI (2008) J Electroanal Chem 621:13. doi:10.1016/j.jelechem.2008.04.006
Shin HC, Liu M (2005) Adv Funct Mater 15:582. doi:10.1002/adfm.200305165
Dima GE, de Vooys ACA, Koper MTM (2003) J Electroanal Chem 554–555:15
Pletcher D, Poorbedi Z (1979) Electrochim Acta 24:1253. doi:10.1016/0013-4686(79)87081-4
Kim J-H, Kim R-H, H-Sang K (2008) Electrochem Commun 10:1148. doi:10.1016/j.elecom.2008.05.035
Oniciu L, Muresan L (1991) J Appl Electrochem 21:565. doi:10.1007/BF01024843
Muresan L, Varvara S (2005) In: Nunez M (ed) Metal electrodeposition. Nova Science, New York, pp 1–45.
Popov KI, Maksimović MD (1989) In: Conway BE, Bockris JO’M, White RE (eds) Modern aspects of electrochemistry, vol. 19. Plenum, New York
Paunovic M (2000) In: Schlesinger M, Paunovic M (eds) Modern electroplating. Wiley, New York
Popov KI, Djokić SS, Grgur BN (2002) Fundamental aspects of electrometallurgy. Kluwer, New York
Chi-Chang H, Chi-Ming W (2003) Surf Coat Technol 176:75. doi:10.1016/S0257-8972(03)00004-5
Chandrasekar MS, Pushpavanam M (2008) Electrochim Acta 53:3313. doi:10.1016/j.electacta.2007.11.054
Landolt D, Marlot A (2003) Surf Coat Technol 169–170:8. doi:10.1016/S0257-8972(03)00042-2
Tantavichet N, Pritzker MD (2005) Electrochim Acta 50:1849. doi:10.1016/j.electacta.2004.08.045
Nikolić ND, Branković G, Pavlović MG, Popov KI (2009) Electrochem Commun 11:421. doi:10.1016/j.elecom.2008.12.007
Popov KI, Stojilković ER, Radmilović V, Pavlović MG (1997) Powder Technol 93:55. doi:10.1016/S0032-5910(97)03258-0
Barton L, Bockris JO`M (1962) Proc Roy Soc A268:485
Despić A, Popov KI (1972) In: Conway BE, Bockris JO’M, White RE (eds) Modern aspects of electrochemistry, vol. 7. Plenum, New York.
Acknowledgement
The work was supported by the Ministry of Science and Technological Development of the Republic of Serbia under the research project: “Deposition of ultrafine powders of metals and alloys and nanostructured surfaces by electrochemical techniques” (no. 142032G).
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Nikolić, N.D., Branković, G., Maksimović, V.M. et al. Application of pulsating overpotential regime on the formation of copper deposits in the range of hydrogen co-deposition. J Solid State Electrochem 14, 331–338 (2010). https://doi.org/10.1007/s10008-009-0842-1
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DOI: https://doi.org/10.1007/s10008-009-0842-1