Abstract
The effects of curing time at room temperature and methanol extracts from Acacia mangium on the curing behavior of resorcinol formaldehyde (RF) adhesive were examined by using the thermomechanical analysis spring method. For a specimen that was cured for 3 months at room temperature, the relative elasticity (E r) curve did not change to a hard glass state from room temperature to 200°C and the adhesive had cured completely. The initial temperature of the reactive zone for chemical and mechanical changes was 15° and 25°C higher than that for the control when 10 and 15 parts by weight methanol extract was added to the liquid adhesive, respectively. It appears that the extractives of A. mangium in RF adhesive interferes with the chemical cure of the adhesive. It is suggested that a combination of curing time and sweeping by methanol on the laminae surface can improve the bonding performance of A. mangium laminates bonded with RF at room temperature.
Article PDF
Similar content being viewed by others
References
Alamsyah EM, Nan LC, Yamada M, Taki K, Yoshida H (2007) Bondability of tropical fast-growing tree species I: Indonesian wood species. J Wood Sci 53:40–46
Taki K, Mizumachi H, Yamagishi Y (1979) Bond quality of PVAisocyanate reactive resin adhesives (II) (in Japanese). Mokuzai Gakkaishi 25:216–224
Nan LC (2005) Bond quality of moisture curing polyurethane adhesives (in Japanese). Masters thesis, Faculty of Agriculture, Shizuoka University, Shizuoka, Japan
Sato Y, Taki K, Yoshida H (1997) Thermal analysis and bond quality of thermosetting resin adhesives (in Japanese). Proceedings of the 35th Annual Meeting of the Adhesion Society of Japan, Tokyo, pp 129–130
Taki K, Yamada M, Yoshida H (1998) Thermal analysis and bond strength of thermosetting resin. Book of abstracts, 1st World Congress on Adhesion and Related Phenomena, Germany, p 167
Taki K, Yoshida H, Yamada M (2001) Thermal analysis and bond quality of phenol-formaldehyde resin adhesives. Proceedings of Wood Adhesive 2000 No.7252, USDA, USA, pp 351–355
Adachi K, Taki K (2007) Curing behavior of wood adhesives and bond quality. In: Curing temperature of resin and methods and assessment of curing process. Science and Technology, Osaka, pp 175–187
Mizumachi H (1973) Activation energy of the curing reaction of urea resin in the presence of wood. Wood Sci 7:14–18
Mizumachi H, Morita H (1975) Activation energy of the curing reaction of phenolic resin in the presence of woods. Wood Sci 7:256–260
Pizzi A, Stephanou A (1994) Phenol formaldehyde wood adhesives under very alkaline conditions, part I: behavior and proposed mechanism. Holzforschung 48:35–40
Umemura K, Kawai S, Mizuno Y, Sasaki H (1995) Dynamic mechanical properties of thermosetting resin adhesives I, phenolic resin (in Japanese). Mokuzai Gakkaishi 41:820–827
Umemura K, Kawai S, Nishioka R, Mizuno Y, Sasaki H (1995) Curing behavior of wood adhesives under high-pressure steam I, phenolic resin. Mokuzai Gakkaishi 41:828–836
Umemura K, Takahashi A, Kawai S (1998) Durability of isocyanate resin adhesives for wood I: thermal properties of isocyanate resin cured with water. J Wood Sci 44:204–210
Firmanti A, Sabarudin A, Subrata JF (2004) Application of mechanical stress grading for effective utilization of tropical fastgrowing species for building material. Proceedings of the 5th International Wood Science Symposium, Kyoto, pp 47–56
Matsumoto Y (2003) Report of Acacia hybrid plantation in Sabah, Malaysia. Proceedings of the International Symposium on Sustainable Utilization of Acacia mangium, Kyoto, Japan, pp 124–127
Abe I, Akimoto N (1976) The inhibitory effect of kapur wood extractives on the curing reaction of the resol (in Japanese). Mokuzai Gakkaishi 22:191–196
Abe I, Ono K (1980) Effect of the acidity of some tropical wood extractives on the curing of the resol. Mokuzai Gakkaishi 26: 689–692
Hse CY, Kuo MI (1988) Influence of extractives on wood gluing and finishing — a review. Forest Prod J 38:52–56
Tachi M, Nagadomi W, Tange J, Yasuda S, Terashima N (1988) Manufacture of wood-cement boards II-cement bonded particle boards from Malaysian fast-growing tress (in English). Mokuzai Gakkaishi 34:761–764
Tachi M, Tange J, Nagadomi W, Suzuki Y, Terashima N, Yasuda S (1989) Manufacture of wood-cement boards IV-cement hardening inhibitory components of the Malaysian fast-growing tree, Acacia mangium. Mokuzai Gakkaishi 35:731–735
Hirabayashi Y, Nakano T (1997) Adhesive and coating properties of tropical wood (in Japanese). Mokuzai Gakkaishi 43:356–363
Tohmura S (1998) Acceleration of the cure of phenolic resin adhesives VII: influence of extractive of merbau on bonding. J Wood Sci 44:211–216
Sakuno T, Moredo C Jr (1998) Bonding properties of some tropical woods after solvent extraction. Proceedings of the 2nd International Wood Science Seminar, Serpong, Indonesia, pp C183–C197
Kyowa Interface (1990) Face contact-angle meter CA-DT type A (in Japanese). Kyowa Interface, Japan
Ministry of Agriculture, Forestry and Fisheries of Japan (2005) Japanese Agricultural Standard JAS No.235 for Structural Glued Laminated Timber. Ministry of Agriculture, Forestry and Fisheries of Japan, Tokyo
Wellons JD (1980) Wettability and gluability of Douglas-fir veneer. Forest Prod J 30:53–55
Bodig J (1962) Wettability related to gluabilities of five Philippine mahoganies. Forest Prod J 12:265–270
Author information
Authors and Affiliations
Corresponding author
About this article
Cite this article
Alamsyah, E.M., Yamada, M. & Taki, K. Bondability of tropical fast-growing tree species III: curing behavior of resorcinol formaldehyde resin adhesive at room temperature and effects of extractives of Acacia mangium wood on bonding. J Wood Sci 54, 208–213 (2008). https://doi.org/10.1007/s10086-007-0945-1
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10086-007-0945-1