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1 THz Micromachined Waveguide Band-Pass Filter

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Abstract

This paper presents a waveguide band-pass filter operating at the 0.75 ∼ 1.1 THz frequency band. The metal conductivity, the surface impedance, and the skin depth are investigated in the terahertz (THz) frequency band for more accurate designs, especially at the 1 THz and higher frequencies. Because the influence of the fabrication tolerance on the component performance cannot be negligible while the frequency increases, it is a necessary to adopt the simple structure with less resonant cavities for obtaining the given performance. Therefore, the filter in this paper is designed based on the TE301/TE102 dual-mode rectangular waveguide resonant cavities, which has fewer cavities and better rejection of the stop-band. The proposed filter is fabricated using the deep reactive ion etching (DRIE) micromachining technique. Measured results are in good agreement with simulations, which verifies the accuracy of the analysis above, and the design process is valuable to realize high-performance passive components while the frequency is up to 1 THz or higher frequencies.

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Acknowledgments

The authors would like to thank Haotian Zhu and Peng Wu, Department of Electronic Engineering, City University of Hong Kong, for the measurement and helpful discussion. This work was supported by the National Natural Science Foundation of China (G0501020161371054).

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Authors and Affiliations

  1. School of Electronic Engineering, University of Electronic Science and Technology of China, Chengdu, China

    Shuang Liu, Jiang Hu, Yong Zhang, Zhongwan Zheng, Yupeng Liu & Ruimin Xu

  2. Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong, China

    Quan Xue

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  1. Shuang Liu
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  2. Jiang Hu
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  3. Yong Zhang
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  4. Zhongwan Zheng
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  5. Yupeng Liu
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  7. Quan Xue
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Correspondence to Shuang Liu.

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Liu, S., Hu, J., Zhang, Y. et al. 1 THz Micromachined Waveguide Band-Pass Filter. J Infrared Milli Terahz Waves 37, 435–447 (2016). https://doi.org/10.1007/s10762-015-0229-6

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  • DOI: https://doi.org/10.1007/s10762-015-0229-6

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