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Measurement of Solder/Copper Interfacial Thermal Resistance by the Flash Technique

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Abstract

A feasibility study was conducted to determine the interfacial thermal resistance (ITR) in both bi- and tri-layered eutectic lead–tin solder/copper specimens by the flash technique. The solder/copper ITR results of the two sets of specimen showed excellent agreement. The values were found to range from 0.011 to 0.033K·cm2·W−1 with an average of about 0.020 K·cm2· W−1. The variation was attributed primarily to the imperfection of the solder/copper bonding established by scanning acoustic microscopy.

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Authors and Affiliations

  1. Center for Power Electronics Systems (CPES), Virginia Polytechnic Institute and State University, Blacksburg, Virginia, 24061, U.S.A

    J. G. Bai, Z. Z. Zhang & G.-Q. Lu

  2. Department of Materials Science and Engineering, Virginia Polytechnic Institute and State University, Blacksburg, Virginia, 24061, U.S.A

    J. G. Bai, G.-Q. Lu & D. P. H. Hasselman

  3. The Bradley Department of Electrical and Computer Engineering, Virginia Polytechnic, Institute and State University, Blacksburg, Virgina, 24061, U.S.A

    Z. Z. Zhang & G.-Q. Lu

Authors
  1. J. G. Bai
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  2. Z. Z. Zhang
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  3. G.-Q. Lu
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  4. D. P. H. Hasselman
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Corresponding author

Correspondence to G.-Q. Lu.

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Bai, J.G., Zhang, Z.Z., Lu, GQ. et al. Measurement of Solder/Copper Interfacial Thermal Resistance by the Flash Technique. Int J Thermophys 26, 1607–1615 (2005). https://doi.org/10.1007/s10765-005-8107-4

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  • DOI: https://doi.org/10.1007/s10765-005-8107-4

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