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Journal of Electronic Testing
Erschienen in: Journal of Electronic Testing 5/2017

02.09.2017

Three-Stage Optimization of Pre-Bond Diagnosis of TSV Defects

verfasst von: Bei Zhang, Vishwani D. Agrawal

Erschienen in: Journal of Electronic Testing | Ausgabe 5/2017

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Abstract

Pre-bond TSV testing and defect identification is important for yield assurance of 3D stacked devices. Building on a recently proposed pre-bond TSV probing procedure, this paper develops a three-stage optimization method named “SOS3” to greatly reduce TSV test time without losing the capability of identifying given number of faulty TSVs. The optimization stages are as follows. First, an integer linear programming (ILP) model generates a near-optimal set of test sessions for pre-bond defective TSV diagnosis. Second, an iterative greedy procedure sequences the application of those test sessions for quicker diagnosis. Third, a TSV defect identification algorithm terminates testing as quickly as possible, often before all sessions are applied. Extensive simulation experiments are done for various TSV networks and the results show that the SOS3 framework greatly speeds up the pre-bond TSV test.
Vorheriger Artikel A Novel Noise-assisted Prognostic Method for Linear Analog Circuits
Nächster Artikel Efficient Techniques for Fault Detection and Correction of Reversible Circuits

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Metadaten
Titel
Three-Stage Optimization of Pre-Bond Diagnosis of TSV Defects
verfasst von
Bei Zhang
Vishwani D. Agrawal
Publikationsdatum
02.09.2017
Verlag
Springer US
Erschienen in
Journal of Electronic Testing / Ausgabe 5/2017
Print ISSN: 0923-8174
Elektronische ISSN: 1573-0727
DOI
https://doi.org/10.1007/s10836-017-5681-x

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