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Journal of Materials Science
Erschienen in: Journal of Materials Science 7/2016

21.12.2015 | Original Paper

Die-attaching silver paste based on a novel solvent for high-power semiconductor devices

verfasst von: Jinting Jiu, Hao Zhang, Shijo Nagao, Tohru Sugahara, Noriko Kagami, Youji Suzuki, Yasuyuki Akai, Katsuaki Suganuma

Erschienen in: Journal of Materials Science | Ausgabe 7/2016

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Abstract

A new solvent composed of 4-(tert-butyl) cyclohexyl acetate as a dilute agent and HPMDA as a thickener was developed to make micron-sized Ag paste and to bond power semiconductors. The new Ag paste achieved sentinel printing to form sharp Ag patterns with uniform thickness and defined boundaries, which is a key to printing fine pitches in the electronics industry. The electrical resistivity of Ag patterns of 3 μΩ cm was obtained at 280 °C for 30 min. Two Ag-plating copper substrates were successfully bonded with the new Ag paste and the shear strength gradually increased with the bonding temperature. A high strength of 80 MPa was achieved at 280 °C under a small sintering pressure of 0.4 MPa. This value is far higher than the value obtained by using an expensive Ag nanoparticle paste. The detailed mechanism is discussed in this work by comparison with common ethylene glycol solvent.
Vorheriger Artikel Grain structure evolution at sintering of the bulk Bi2Te3 nanomaterial under hot pseudo-isostatic pressure
Nächster Artikel Influence of structural and textural parameters of carbon nanofibers on their capacitive behavior

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Metadaten
Titel
Die-attaching silver paste based on a novel solvent for high-power semiconductor devices
verfasst von
Jinting Jiu
Hao Zhang
Shijo Nagao
Tohru Sugahara
Noriko Kagami
Youji Suzuki
Yasuyuki Akai
Katsuaki Suganuma
Publikationsdatum
21.12.2015
Verlag
Springer US
Erschienen in
Journal of Materials Science / Ausgabe 7/2016
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-015-9659-8

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