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Erschienen in:
01.07.2012
Fabrication and characterization of nano filler-filled epoxy composites for underfill application
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 7/2012
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Abstract
The present research aims to fabricate and characterize different nano filler types and filler loadings in epoxy composites for underfill application. The nano filler types were synthetic diamond (SD), boron nitride (BN), and silica (S). The filler loadings which were considered in the study were varied from 1 to 4 vol%. Sonication process was used to facilitate filler dispersion. The results showed that BN had a good flow ability, with higher flow rates than the other filler types. The thermal conductivity of the composites increased with the addition of fillers, and higher thermal conductivity value is observed in SD system. The coefficient of thermal expansion (CTE) of composites decreased with the addition of filler with lower CTE value shown by BN system. Generally, SD showed higher flexural strength and flexural modulus compared with BN and S. A high filler loading also resulted in decreased flexural strength but increased flexural modulus.