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Erschienen in:
01.01.2015
Low-temperature densification of diamond/Cu composite prepared from dual-layer coated diamond particles
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 1/2015
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Abstract
High-density diamond/Cu composites with good thermal properties were fabricated by low-temperature hot-press sintering via designing dual layers on diamond. The microstructure observations indicate that a good interface bonding is obtained between diamond and copper. The inner tungsten coating on diamond is uniform and the formed carbides establish chemical and covalent interaction at the interface. The outside copper coating changes the sintering system of diamond–copper to copper–copper and thus favors the low-temperature densification of diamond/Cu composites. Finally, the sintered composites with dual-layer coated diamond have excellent thermal conductivity of 695 W m−1 K−1 compared with the single coating diamond composites of 386 W m−1 K−1.