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Erschienen in: Journal of Materials Science: Materials in Electronics 8/2015

01.08.2015

Effect of graphene nanosheets on the corrosion behavior of Sn–Ag–Cu solders

verfasst von: L. Y. Xu, Z. K. Zhang, H. Y. Jing, J. Wei, Y. D. Han

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 8/2015

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Abstract

In this study, the effect of graphene nanosheets (GNSs) on the corrosion resistance of 96.5Sn–3Ag–0.5Cu (SAC) solder at ambient temperature in a 3.5 wt% NaCl solution was investigated using the potentiodynamic polarization method . The corrosion products were analyzed by field emission-scanning electron microscope, energy dispersive spectroscopy , and X-ray diffraction. The results showed that the GNSs affect the anodic polarization behavior of the solders. Adding GNSs enhanced the corrosion resistance of the SAC solder, as GNSs content increased to 0.03 wt%, the corrosion resistance peaked and then declined with further increment in the wt% of the GNSs. Overall, the corrosion resistance of SAC/GNSs was found to be more superior than that of the pure SAC. The mechanism of the corrosion resistance improvement can be explained by the formation of a compact corrosion layer of the GNSs. This provides an inert physical barrier to the initiation and development of corrosion. As the GNSs content further increased (more than 0.03 wt%), the corrosion resistance of the SAC/GNSs solder decreased.

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Literatur
1.
Zurück zum Zitat F. Rosalbino, E. Angelini, G. Zanicchi, R. MarazzaE, Corrosion behaviour assessment of lead-free Sn–Ag–M (M = In, Bi, Cu) solder alloys. J. Electron. Mater. 109, 386–391 (2008) F. Rosalbino, E. Angelini, G. Zanicchi, R. MarazzaE, Corrosion behaviour assessment of lead-free Sn–Ag–M (M = In, Bi, Cu) solder alloys. J. Electron. Mater. 109, 386–391 (2008)
2.
Zurück zum Zitat Y. Li, K. Moon, C.P. Wong, Electronics without lead. Science 308, 1419–1420 (2005)CrossRef Y. Li, K. Moon, C.P. Wong, Electronics without lead. Science 308, 1419–1420 (2005)CrossRef
3.
Zurück zum Zitat I.E. Anderson, Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications. J. Mater. Sci. Mater. Electron. 18, 55–76 (2007)CrossRef I.E. Anderson, Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications. J. Mater. Sci. Mater. Electron. 18, 55–76 (2007)CrossRef
4.
Zurück zum Zitat C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, Properties of lead-free solder alloys with rare earth element additions. Mater. Sci. Eng., R 44, 1–44 (2004)CrossRef C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, Properties of lead-free solder alloys with rare earth element additions. Mater. Sci. Eng., R 44, 1–44 (2004)CrossRef
5.
Zurück zum Zitat Y.D. Han, H.Y. Jing, S.M.L. Nai, C.M. Tan, J. Wei, L.Y. Xu, S.R. Zhang, A modified constitutive model for creep of Sn–3.5Ag–0.7Cu solder joints. J. Phys. D Appl. Phys. 42, 125411 (2009)CrossRef Y.D. Han, H.Y. Jing, S.M.L. Nai, C.M. Tan, J. Wei, L.Y. Xu, S.R. Zhang, A modified constitutive model for creep of Sn–3.5Ag–0.7Cu solder joints. J. Phys. D Appl. Phys. 42, 125411 (2009)CrossRef
6.
Zurück zum Zitat F.B. Song, S.W.R. Lee, Investigation of IMC thickness effect on the lead-free solder ball attachment strength: comparison between ball shear test and cold bump pull test results, in 56th Electronic Components and Technology Conference 2006, vol. 1–2, (2006), pp. 891–898 F.B. Song, S.W.R. Lee, Investigation of IMC thickness effect on the lead-free solder ball attachment strength: comparison between ball shear test and cold bump pull test results, in 56th Electronic Components and Technology Conference 2006, vol. 12, (2006), pp. 891–898
7.
Zurück zum Zitat Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Temperature dependence of creep and hardness of Sn–Ag–Cu lead-free solder. J. Electron. Mater. 39, 223–229 (2010)CrossRef Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Temperature dependence of creep and hardness of Sn–Ag–Cu lead-free solder. J. Electron. Mater. 39, 223–229 (2010)CrossRef
8.
Zurück zum Zitat J.S. Lee, K.M. Chu, R. Patzelt, D. Manessis, A. Ostmann, D.Y. Jeon, Effects of Co addition in eutectic Sn–3.5Ag solder on shear strength and microstructural development. Microelectron. Eng. 85, 1577–1583 (2008)CrossRef J.S. Lee, K.M. Chu, R. Patzelt, D. Manessis, A. Ostmann, D.Y. Jeon, Effects of Co addition in eutectic Sn–3.5Ag solder on shear strength and microstructural development. Microelectron. Eng. 85, 1577–1583 (2008)CrossRef
9.
Zurück zum Zitat H.T. Lee, Y.H. Lee, Adhesive strength and tensile fracture of Ni particle enhanced Sn–Ag composite solder joints. Mater. Sci. Eng. A 419, 172–180 (2006)CrossRef H.T. Lee, Y.H. Lee, Adhesive strength and tensile fracture of Ni particle enhanced Sn–Ag composite solder joints. Mater. Sci. Eng. A 419, 172–180 (2006)CrossRef
10.
Zurück zum Zitat L.C. Tsao, S.Y. Chang, Effects of nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder. Mater. Des. 31, 990–993 (2010)CrossRef L.C. Tsao, S.Y. Chang, Effects of nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder. Mater. Des. 31, 990–993 (2010)CrossRef
11.
Zurück zum Zitat X.H. Chen, C.S. Chen, H.N. Xiao, F.Q. Cheng, G. Zhan, G.J. Yi, Corrosion behavior of carbon nanotubes–Ni composite coating. Surf. Coat. Technol. 191, 351–356 (2005)CrossRef X.H. Chen, C.S. Chen, H.N. Xiao, F.Q. Cheng, G. Zhan, G.J. Yi, Corrosion behavior of carbon nanotubes–Ni composite coating. Surf. Coat. Technol. 191, 351–356 (2005)CrossRef
12.
Zurück zum Zitat Y.D. Han, S.M.L. Nai, H.Y. Jing, L.Y. Xu, C.M. Tan, J. Wei, Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes. J. Mater. Sci. Mater. Electron. 22, 315–322 (2011)CrossRef Y.D. Han, S.M.L. Nai, H.Y. Jing, L.Y. Xu, C.M. Tan, J. Wei, Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes. J. Mater. Sci. Mater. Electron. 22, 315–322 (2011)CrossRef
13.
Zurück zum Zitat Y.D. Han, S.M.L. Nai, H.Y. Jing, L.Y. Xu, C.M. Tan, J. Wei, Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes. J. Mater. Sci. Mater. Electron. 23, 1108–1115 (2012)CrossRef Y.D. Han, S.M.L. Nai, H.Y. Jing, L.Y. Xu, C.M. Tan, J. Wei, Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes. J. Mater. Sci. Mater. Electron. 23, 1108–1115 (2012)CrossRef
14.
Zurück zum Zitat A.K. Geim, K.S. Novoselov, The rise of graphene. Nat. Mater. 6, 183–191 (2007)CrossRef A.K. Geim, K.S. Novoselov, The rise of graphene. Nat. Mater. 6, 183–191 (2007)CrossRef
15.
Zurück zum Zitat S. Park, R. Ruoff, Chemical methods for the production of graphenes. Nat. Nanotechnol. 4, 217–224 (2009)CrossRef S. Park, R. Ruoff, Chemical methods for the production of graphenes. Nat. Nanotechnol. 4, 217–224 (2009)CrossRef
16.
Zurück zum Zitat X.D. Liu, Y.D. Han, H.Y. Jing, J. Wei, L.Y. Xu, Effect of graphene nanosheets reinforcement on the performance of Sn–Ag–Cu lead-free solder. Mater. Sci. Eng. A 562, 25–32 (2013)CrossRef X.D. Liu, Y.D. Han, H.Y. Jing, J. Wei, L.Y. Xu, Effect of graphene nanosheets reinforcement on the performance of Sn–Ag–Cu lead-free solder. Mater. Sci. Eng. A 562, 25–32 (2013)CrossRef
17.
Zurück zum Zitat Q.V. Bui, N.D. Nam, B.I. Noh, A. Kar, J.G. Kim, S.B. Jung, Effect of Ag addition on the corrosion properties of Sn-based solder alloys. Mater. Corros. 61, 30–33 (2010)CrossRef Q.V. Bui, N.D. Nam, B.I. Noh, A. Kar, J.G. Kim, S.B. Jung, Effect of Ag addition on the corrosion properties of Sn-based solder alloys. Mater. Corros. 61, 30–33 (2010)CrossRef
18.
Zurück zum Zitat J.Y. Wang, Z.Q. Li, G.L. Fan, H.H. Pan, Z.X. Chen, D. Zhang, Reinforcement with graphene nanosheets in aluminum matrix composites. Scr. Mater. 66, 594–597 (2012)CrossRef J.Y. Wang, Z.Q. Li, G.L. Fan, H.H. Pan, Z.X. Chen, D. Zhang, Reinforcement with graphene nanosheets in aluminum matrix composites. Scr. Mater. 66, 594–597 (2012)CrossRef
19.
Zurück zum Zitat H.T. Ma, J.C. Suhling, A review of mechanical properties of lead-free solders for electronic packaging. J. Mater. Sci. 44, 1141–1158 (2009)CrossRef H.T. Ma, J.C. Suhling, A review of mechanical properties of lead-free solders for electronic packaging. J. Mater. Sci. 44, 1141–1158 (2009)CrossRef
20.
Zurück zum Zitat S.W. Chen, C.H. Wang, C.K. Lin, C.N. Chiu, A review of mechanical properties of lead-free solders for electronic packaging. J. Mater. Sci. Mater. Electron. 18, 19–37 (2007)CrossRef S.W. Chen, C.H. Wang, C.K. Lin, C.N. Chiu, A review of mechanical properties of lead-free solders for electronic packaging. J. Mater. Sci. Mater. Electron. 18, 19–37 (2007)CrossRef
21.
Zurück zum Zitat X. Zhao, Q. Zhang, D. Chen, Enhanced mechanical properties of graphene-based poly(vinyl alcohol) composites. Macromolecules 43, 2357–2363 (2010)CrossRef X. Zhao, Q. Zhang, D. Chen, Enhanced mechanical properties of graphene-based poly(vinyl alcohol) composites. Macromolecules 43, 2357–2363 (2010)CrossRef
22.
Zurück zum Zitat S. Vadukumpully, J. Paul, N. Mahanta, S. Valiyaveettil, Flexible conductive graphene/poly(vinyl chloride) composite thin films with high mechanical strength and thermal stability. Carbon 49, 198–205 (2011)CrossRef S. Vadukumpully, J. Paul, N. Mahanta, S. Valiyaveettil, Flexible conductive graphene/poly(vinyl chloride) composite thin films with high mechanical strength and thermal stability. Carbon 49, 198–205 (2011)CrossRef
23.
Zurück zum Zitat H. Ming, J. Wang, Z. Zhang, S. Wang, E.H. Han, W. Ke, Multilayer graphene: a potential anti-oxidation barrier in simulated primary water. J. Mater. Sci. Technol. 30, 1084–1087 (2014)CrossRef H. Ming, J. Wang, Z. Zhang, S. Wang, E.H. Han, W. Ke, Multilayer graphene: a potential anti-oxidation barrier in simulated primary water. J. Mater. Sci. Technol. 30, 1084–1087 (2014)CrossRef
24.
Zurück zum Zitat Y.D. Han, L. Chen, H.Y. Jing, S.M.L. Nai, J. Wei, L.Y. Xu, Effect of Ni-coated carbon nanotubes on the corrosion behavior of Sn–Ag–Cu Solder. J. Electron. Mater. 42, 3559–3566 (2013)CrossRef Y.D. Han, L. Chen, H.Y. Jing, S.M.L. Nai, J. Wei, L.Y. Xu, Effect of Ni-coated carbon nanotubes on the corrosion behavior of Sn–Ag–Cu Solder. J. Electron. Mater. 42, 3559–3566 (2013)CrossRef
25.
Zurück zum Zitat Y.H. Hu, S.B. Xue, H. Ye, Z. Xiao, L.L. Gao, G. Zeng, Reliability studies of Sn–9Zn/Cu and Sn–9Zn–0.06Nd/Cu joints with aging treatment. Mater. Des. 34, 768–775 (2012)CrossRef Y.H. Hu, S.B. Xue, H. Ye, Z. Xiao, L.L. Gao, G. Zeng, Reliability studies of Sn–9Zn/Cu and Sn–9Zn–0.06Nd/Cu joints with aging treatment. Mater. Des. 34, 768–775 (2012)CrossRef
26.
Zurück zum Zitat L.C. Tsao, T.T. Lo, S.F. Peng, S.Y. Chang, Electrochemical behavior of a new Sn3.5Ag0.5Cu composite solder. in 11th International Conference on Electronic Packaging Technology and High Density Packaging. ,(2010), pp. 1013–1017 L.C. Tsao, T.T. Lo, S.F. Peng, S.Y. Chang, Electrochemical behavior of a new Sn3.5Ag0.5Cu composite solder. in 11th International Conference on Electronic Packaging Technology and High Density Packaging. ,(2010), pp. 1013–1017
27.
Zurück zum Zitat Y. Liu, Y.F. Cheng, Role of second phase particles in pitting corrosion of 3003 Al alloy in NaCl solution. Mater. Corros. 61, 211–217 (2010)CrossRef Y. Liu, Y.F. Cheng, Role of second phase particles in pitting corrosion of 3003 Al alloy in NaCl solution. Mater. Corros. 61, 211–217 (2010)CrossRef
28.
Zurück zum Zitat A. Pardo, M.C. Merino, A.E. Coy, R. Arrabal, F. Viejo, E. Matykona, Corrosion behaviour of magnesium/aluminium alloys in 3.5 wt% NaCl. Corros. Sci. 50, 823–834 (2008)CrossRef A. Pardo, M.C. Merino, A.E. Coy, R. Arrabal, F. Viejo, E. Matykona, Corrosion behaviour of magnesium/aluminium alloys in 3.5 wt% NaCl. Corros. Sci. 50, 823–834 (2008)CrossRef
29.
Zurück zum Zitat G. Ben-Hamu, A. Eliezer, E.M. Gutman, RETRACTED: electrochemical behavior of magnesium alloys strained in buffer solutions. Electrochim. Acta 52, 304–313 (2006)CrossRef G. Ben-Hamu, A. Eliezer, E.M. Gutman, RETRACTED: electrochemical behavior of magnesium alloys strained in buffer solutions. Electrochim. Acta 52, 304–313 (2006)CrossRef
30.
Zurück zum Zitat L. Zhang, Effects of Grain Size on the Corrosion Behaviors of Zinc and Trivalent Chromium Passivation Film on Zinc. A Dissertation for the Degree of M. Eng, (2008), p. 12 L. Zhang, Effects of Grain Size on the Corrosion Behaviors of Zinc and Trivalent Chromium Passivation Film on Zinc. A Dissertation for the Degree of M. Eng, (2008), p. 12
31.
Zurück zum Zitat B.M. Praveen, T.V. Venkatesha, Y. Arthoba Naik, K. Prashantha, Corrosion studies of carbon nanotubes–Zn composite coating. Surf. Coat. Technol. 201, 5836–5842 (2007)CrossRef B.M. Praveen, T.V. Venkatesha, Y. Arthoba Naik, K. Prashantha, Corrosion studies of carbon nanotubes–Zn composite coating. Surf. Coat. Technol. 201, 5836–5842 (2007)CrossRef
Metadaten
Titel
Effect of graphene nanosheets on the corrosion behavior of Sn–Ag–Cu solders
verfasst von
L. Y. Xu
Z. K. Zhang
H. Y. Jing
J. Wei
Y. D. Han
Publikationsdatum
01.08.2015
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 8/2015
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-015-3112-2

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