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Erschienen in:
01.08.2015
Effects of coupled stressing and solid-state aging on the mechanical properties of Sn–58Bi–0.7Zn solder joint
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 8/2015
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Abstract
The mechanical properties of coupled and aged Sn–58Bi–0.7Zn solder joint were respectively investigated in this study. During tensile tests, the ultimate tensile strength of electromigration and thermal aging coupled solder joint was ascribed to the weakening of the anode interface between intermetallic compounds and Bi layer. It was due to the Bi segregation which led to the formation of vacancies and stress concentration at the Cu–Sn–Zn/Cu–Zn interface in the aged solder joint. Nanoindentation results revealed that the creep resistance of coupled solder joint was higher than that of the aged solder joint, which was because the Bi layer could play a role of load transfer at the solder joint interface in coupled sample.