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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 3/2016

06.11.2015

Effect of sintering temperatures on properties of BaO–B2O3–SiO2–Al2O3 glass/silica composites for CBGA package

verfasst von: Bo Li, Quanyin Long, Dinan Duan

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 3/2016

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Abstract

BaO–B2O3–SiO2–Al2O3 (BBSA) glass/silica composites synthesized by solid-state reaction method were developed for CBGA packages, and the effects of sintering temperature (900–950 °C) on the phase transformation, microstructure, thermal, mechanical and electrical properties were investigated. XRD results show that the major phases quartz and cristobalite, and the minor phase BaSi2O5 are detected in BBSA composites. Furthermore, it was found that the quartz phase transforms to cristobalite phase at 930–940 °C. The formation of cristobalite phase with higher coefficient of thermal expansion (CTE) led to the increase of CTE value of BBSA composites. However, excessive cristobalite phase content would degrade the mechanical properties and the linearity of thermal expansion of the ceramics. BBSA composites sintered at 920 °C exhibited excellent properties: low dielectric constant and loss (εr = 6.2, tanδ = 10−4 at 1 MHz), high bending strength (179 MPa), high CTE (12.19 ppm/°C) as well as superior linearity of the thermal expansion.
Vorheriger Artikel The formation and conversion of intermetallic compounds in the Cu pillar Sn–Ag micro-bump with ENEPIG Cu substrate under current stressing
Nächster Artikel Thermal blooming and photoluminescence characterizations of sol–gel CdO–SiO2 with different nanocomposite

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Metadaten
Titel
Effect of sintering temperatures on properties of BaO–B2O3–SiO2–Al2O3 glass/silica composites for CBGA package
verfasst von
Bo Li
Quanyin Long
Dinan Duan
Publikationsdatum
06.11.2015
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 3/2016
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-015-4012-1

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