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Tribology Letters
Erschienen in: Tribology Letters 1/2013

01.01.2013 | Original Paper

Effects of Proximity on Hardness and Elastic Modulus Measurements of SiO2 and Cu by Nanoindentation

verfasst von: Hae Jin Kim, Dae Eun Kim

Erschienen in: Tribology Letters | Ausgabe 1/2013

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Abstract

The effects of distance between two indentation points in the measurements of hardness and elastic modulus by the nanoindentation technique were assessed. Silicon Oxide (SiO2) and Cu were used to represent the nanoindentation behavior of brittle and ductile material, respectively. The distance between two indentation points was varied from being sufficiently far apart to being almost adjacent to the boundary of the neighboring indentation mark. Contrary to common understanding, it was discovered that proximity between indentation points had almost no effect on the hardness and elastic modulus measurements. Finite element method simulations were also performed to understand and verify the experimental results.
Vorheriger Artikel Surfactant Inducing Phase Change of ZnO Nanorods to Low Friction
Nächster Artikel Plasmonic Diagnostics for Tribology: In Situ Observations Using Surface Plasmon Resonance in Combination with Surface-Enhanced Raman Spectroscopy

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Metadaten
Titel
Effects of Proximity on Hardness and Elastic Modulus Measurements of SiO2 and Cu by Nanoindentation
verfasst von
Hae Jin Kim
Dae Eun Kim
Publikationsdatum
01.01.2013
Verlag
Springer US
Erschienen in
Tribology Letters / Ausgabe 1/2013
Print ISSN: 1023-8883
Elektronische ISSN: 1573-2711
DOI
https://doi.org/10.1007/s11249-012-0050-5

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