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Erschienen in: Metallurgical and Materials Transactions A 10/2014

01.09.2014

A Study on the Effect of Pulse Electrodeposition Parameters on the Morphology of Pure Tin Coatings

verfasst von: Ashutosh Sharma, Sumit Bhattacharya, Siddhartha Das, Karabi Das

Erschienen in: Metallurgical and Materials Transactions A | Ausgabe 10/2014

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Abstract

Pure Sn coatings are prepared by pulse current (PC) electrodeposition using aqueous acidic sulfate plating bath. The effects of various electroplating parameters such as current density, additive concentration, duty cycle, frequency, pH, bath temperature, and stirring rate (bath rotation) on the evolution of surface morphology of the coatings have been studied. The as-deposited coatings are characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), and surface profilometry. It is found that the current density, additive concentration, duty cycle, frequency, and pH have a major influence while temperature and stirring rate of the bath have a minor effect on the grain-size distribution. The mechanism involved in the morphology evolution and grain-size distribution due to the varying electroplating parameters has also been discussed.

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Literatur
1.
Zurück zum Zitat G.T. Gaylon: Annoted Tin Whisker Bibliography and Anthology, NEMI Tin Whisker Modeling Project, pp. 1–64, November 2003. G.T. Gaylon: Annoted Tin Whisker Bibliography and Anthology, NEMI Tin Whisker Modeling Project, pp. 1–64, November 2003.
2.
Zurück zum Zitat H. Leidecker and J. Brusse: Tin Whiskers, a History of Documented Electrical System Failures, A Briefing Prepared for the Space Shuttle Program Office, NASA Goddard Jay Brusse/QSS Group, Inc. April 2006. H. Leidecker and J. Brusse: Tin Whiskers, a History of Documented Electrical System Failures, A Briefing Prepared for the Space Shuttle Program Office, NASA Goddard Jay Brusse/QSS Group, Inc. April 2006.
3.
Zurück zum Zitat J.W. Osenbach, J.M. DeLucca, B.D. Potteiger, A. Amin, F.A. Baiocchi: J. Mater. Sci., 2007, vol. 18, pp. 283–305. J.W. Osenbach, J.M. DeLucca, B.D. Potteiger, A. Amin, F.A. Baiocchi: J. Mater. Sci., 2007, vol. 18, pp. 283–305.
4.
Zurück zum Zitat K.N. Tu, J.C.M. Li: Mater. Sci. Eng. A., 2005, vol. 409, pp. 131–9.CrossRef K.N. Tu, J.C.M. Li: Mater. Sci. Eng. A., 2005, vol. 409, pp. 131–9.CrossRef
5.
Zurück zum Zitat T. Kakeshita, K. Shimizu, R. Kawanaka, T. Hasegawa: J. Mater. Sci., 1982, vol. 17, pp. 2560–66.CrossRef T. Kakeshita, K. Shimizu, R. Kawanaka, T. Hasegawa: J. Mater. Sci., 1982, vol. 17, pp. 2560–66.CrossRef
6.
Zurück zum Zitat Y. Zhang, C. Fan, C. Xu, O. Khaselev, J.A. Abys: CircuiTree, 2004, vol. 7, pp.70–82. Y. Zhang, C. Fan, C. Xu, O. Khaselev, J.A. Abys: CircuiTree, 2004, vol. 7, pp.70–82.
7.
Zurück zum Zitat K. Whitlaw, A. Egli, M. Toben: Circuit World, 2004, vol. 30, pp. 20–24.CrossRef K. Whitlaw, A. Egli, M. Toben: Circuit World, 2004, vol. 30, pp. 20–24.CrossRef
8.
Zurück zum Zitat J.A. Brusse, G.J. Ewell, and J.P. Siplon: Tin Whiskers: Attributes and Mitigation, 22nd Capacitor and Resistor Technology Symposium 2002, New Orleans, LA, 25–29 March 2002, pp. 67–80. J.A. Brusse, G.J. Ewell, and J.P. Siplon: Tin Whiskers: Attributes and Mitigation, 22nd Capacitor and Resistor Technology Symposium 2002, New Orleans, LA, 25–29 March 2002, pp. 67–80.
9.
Zurück zum Zitat L. Durai, R. Dhanasekaran, P. Ramasamy: J. Colloid. Interface Sci., 1987, vol. 115, pp. 372–77.CrossRef L. Durai, R. Dhanasekaran, P. Ramasamy: J. Colloid. Interface Sci., 1987, vol. 115, pp. 372–77.CrossRef
10.
Zurück zum Zitat E. Budevski, G. Staikov, W.J. Lorenz: Electrochim. Acta, 2000, vol., 45, pp. 2559–74.CrossRef E. Budevski, G. Staikov, W.J. Lorenz: Electrochim. Acta, 2000, vol., 45, pp. 2559–74.CrossRef
11.
12.
13.
Zurück zum Zitat K.-W. Moon, S.-K. Kim, M.E. Williams, W.J. Boettinger, G.R. Stafford: J. Appl. Electrochem., 2010, vol. 40, pp. 1671–81.CrossRef K.-W. Moon, S.-K. Kim, M.E. Williams, W.J. Boettinger, G.R. Stafford: J. Appl. Electrochem., 2010, vol. 40, pp. 1671–81.CrossRef
14.
Zurück zum Zitat R. Sekar, C. Eagammai, S. Jayakrishnan: J. Appl. Electrochem., 2010, vol. 40, pp. 49–57.CrossRef R. Sekar, C. Eagammai, S. Jayakrishnan: J. Appl. Electrochem., 2010, vol. 40, pp. 49–57.CrossRef
15.
Zurück zum Zitat A. Vicenzo, S. Bonelli, P.L. Cavallotti: Trans. Inst. Met. Finish., 2010, vol. 88, pp. 248–255.CrossRef A. Vicenzo, S. Bonelli, P.L. Cavallotti: Trans. Inst. Met. Finish., 2010, vol. 88, pp. 248–255.CrossRef
16.
Zurück zum Zitat N.M. Martyak, R. Seefeldt: Electrochim. Acta, 2004, vol. 49, pp. 4303–311.CrossRef N.M. Martyak, R. Seefeldt: Electrochim. Acta, 2004, vol. 49, pp. 4303–311.CrossRef
17.
Zurück zum Zitat M. Paunovic, M. Schlesinger, Fundamentals of Electrochemical Deposition, 2nd ed., New York: Wiley Interscience; 2006.CrossRef M. Paunovic, M. Schlesinger, Fundamentals of Electrochemical Deposition, 2nd ed., New York: Wiley Interscience; 2006.CrossRef
18.
Zurück zum Zitat N.D. Nikolic, K.I. Popov, Lj. J. Pavlovic, M.G. Pavlovic: Surf. Coat. Technol., 2006, vol. 201, pp. 560–66.CrossRef N.D. Nikolic, K.I. Popov, Lj. J. Pavlovic, M.G. Pavlovic: Surf. Coat. Technol., 2006, vol. 201, pp. 560–66.CrossRef
19.
Zurück zum Zitat N.D. Nikolic, G. Brankovic, V.M. Maksimovic: J. Solid State Electrochem., 2012, vol. 16, pp. 321–28.CrossRef N.D. Nikolic, G. Brankovic, V.M. Maksimovic: J. Solid State Electrochem., 2012, vol. 16, pp. 321–28.CrossRef
20.
Zurück zum Zitat K.I. Popov, D.N. Keca, M.D. Andjelic: J. Appl. Eletcrochem., 1978, vol. 9, pp. 19–23.CrossRef K.I. Popov, D.N. Keca, M.D. Andjelic: J. Appl. Eletcrochem., 1978, vol. 9, pp. 19–23.CrossRef
21.
Zurück zum Zitat Z. Liu, M. Zheng, R.D. Hilty, A.C. West: J. Electrochem. Soc., 2010, vol. 157, pp. D411–D416.CrossRef Z. Liu, M. Zheng, R.D. Hilty, A.C. West: J. Electrochem. Soc., 2010, vol. 157, pp. D411–D416.CrossRef
22.
Zurück zum Zitat T. Watanabe: Nano-plating Microstructure Control Theory of Plated Film and Database of Plated Film Microstructure, 1st ed., Oxford: Elsevier; 2004. T. Watanabe: Nano-plating Microstructure Control Theory of Plated Film and Database of Plated Film Microstructure, 1st ed., Oxford: Elsevier; 2004.
23.
Zurück zum Zitat U. Sahaym, S.L. Miller, M.G. Norton: Mater. Lett., 2010, vol. 64, pp. 1547–550.CrossRef U. Sahaym, S.L. Miller, M.G. Norton: Mater. Lett., 2010, vol. 64, pp. 1547–550.CrossRef
24.
Zurück zum Zitat A. Survila, Z. Mockus, S. Kanapeckaite: Electrochim. Acta, 2000, vol. 46, pp. 571–577.CrossRef A. Survila, Z. Mockus, S. Kanapeckaite: Electrochim. Acta, 2000, vol. 46, pp. 571–577.CrossRef
25.
Zurück zum Zitat Y. Nakamura, N. Kaneko, H. Nezu: J. Appl. Electrochem., 1994, vol. 24, pp. 569–74.CrossRef Y. Nakamura, N. Kaneko, H. Nezu: J. Appl. Electrochem., 1994, vol. 24, pp. 569–74.CrossRef
26.
Zurück zum Zitat R. Ichino, C. Cachet, R. Wiart: Electrochim. Acta, 1996, vol. 41, pp. 1031–1039.CrossRef R. Ichino, C. Cachet, R. Wiart: Electrochim. Acta, 1996, vol. 41, pp. 1031–1039.CrossRef
27.
Zurück zum Zitat R. Vittal, H. Gomathi, K.-J. Kim: Adv. Colloid Interface Sci., 2006, vol. 119, pp. 55–68.CrossRef R. Vittal, H. Gomathi, K.-J. Kim: Adv. Colloid Interface Sci., 2006, vol. 119, pp. 55–68.CrossRef
28.
Zurück zum Zitat K. Mitsuda, H. Kimura, T. Murahashi: J. Mater. Sci., 1989, vol. 24, pp. 413–19.CrossRef K. Mitsuda, H. Kimura, T. Murahashi: J. Mater. Sci., 1989, vol. 24, pp. 413–19.CrossRef
29.
30.
Zurück zum Zitat L. Koshy, A.H. Saiyad, A.K. Rakshit: Colloid Polym. Sci., 1996, vol. 274, pp. 582–87.CrossRef L. Koshy, A.H. Saiyad, A.K. Rakshit: Colloid Polym. Sci., 1996, vol. 274, pp. 582–87.CrossRef
31.
Zurück zum Zitat Kh. M. S. Youssef, C. C. Koch, P. S. Fedkiw: J. Electrochem. Soc., 2004, vol. 151, pp. C103–C111.CrossRef Kh. M. S. Youssef, C. C. Koch, P. S. Fedkiw: J. Electrochem. Soc., 2004, vol. 151, pp. C103–C111.CrossRef
32.
Zurück zum Zitat L. Besra, T. Uchikoshi, T.S. Suzuki, Y. Sakka: J. Eur. Ceram. Soc., 2006, vol. 29, pp. 1837–45.CrossRef L. Besra, T. Uchikoshi, T.S. Suzuki, Y. Sakka: J. Eur. Ceram. Soc., 2006, vol. 29, pp. 1837–45.CrossRef
33.
Zurück zum Zitat C. Shanthi, S. Barathan, R. Jaiswal, R.M. Arunachalam, S. Mohan: Mater. Lett., 2008, vol. 62, pp. 4519–21.CrossRef C. Shanthi, S. Barathan, R. Jaiswal, R.M. Arunachalam, S. Mohan: Mater. Lett., 2008, vol. 62, pp. 4519–21.CrossRef
35.
Zurück zum Zitat C. Han, Q. Liu, D.G. Ivey: Electrochim. Acta, 2008, vol. 53, 8332–40.CrossRef C. Han, Q. Liu, D.G. Ivey: Electrochim. Acta, 2008, vol. 53, 8332–40.CrossRef
36.
Zurück zum Zitat O.E. Kongstein, G.M. Haarberg, J. Thonstad: J. Appl. Electrochem., 2007, vol. 37, pp. 669–674.CrossRef O.E. Kongstein, G.M. Haarberg, J. Thonstad: J. Appl. Electrochem., 2007, vol. 37, pp. 669–674.CrossRef
37.
Zurück zum Zitat R. C.M. Salles, G.C.G. de Oliveirab, S.L. Diaza, O.E. Barcia, O.R. Mattosa: Electrochim. Acta, 2011, vol. 56, pp. 7931–39.CrossRef R. C.M. Salles, G.C.G. de Oliveirab, S.L. Diaza, O.E. Barcia, O.R. Mattosa: Electrochim. Acta, 2011, vol. 56, pp. 7931–39.CrossRef
38.
39.
Zurück zum Zitat H. Natter, R. Hempelmann: J. Phys. Chem., 1996, vol. 100, pp. 19525–532.CrossRef H. Natter, R. Hempelmann: J. Phys. Chem., 1996, vol. 100, pp. 19525–532.CrossRef
40.
Zurück zum Zitat A.C. Tan: Tin and Solder Plating in the Semiconductor Industry A Technical Guide, 1st ed., Chapman and Hall, Cambridge, 1993. A.C. Tan: Tin and Solder Plating in the Semiconductor Industry A Technical Guide, 1st ed., Chapman and Hall, Cambridge, 1993.
41.
Zurück zum Zitat S. Wen, J.A. Szpunar: Electrochim. Acta, 2005, vol. 50, pp. 2393–99.CrossRef S. Wen, J.A. Szpunar: Electrochim. Acta, 2005, vol. 50, pp. 2393–99.CrossRef
42.
Zurück zum Zitat A.Y. Musa, Q.J.M. Slaiman, A.A.H. Kadhum, M.S. Takriff: Eur. J. Sci. Res., 2008, vol. 22, pp. 517–524. A.Y. Musa, Q.J.M. Slaiman, A.A.H. Kadhum, M.S. Takriff: Eur. J. Sci. Res., 2008, vol. 22, pp. 517–524.
Metadaten
Titel
A Study on the Effect of Pulse Electrodeposition Parameters on the Morphology of Pure Tin Coatings
verfasst von
Ashutosh Sharma
Sumit Bhattacharya
Siddhartha Das
Karabi Das
Publikationsdatum
01.09.2014
Verlag
Springer US
Erschienen in
Metallurgical and Materials Transactions A / Ausgabe 10/2014
Print ISSN: 1073-5623
Elektronische ISSN: 1543-1940
DOI
https://doi.org/10.1007/s11661-014-2389-8

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