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Deposition Behavior of Copper Fine Particles onto Flat Substrate Surface in Cold Spraying

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Abstract

Cold spray is a promising process to fabricate high-quality metallic coatings. However, it is necessary to improve some properties, especially the adhesive strength of the coating to the substrate to clarify deposition mechanism of the solid particles onto substrate surface. In this study, deposition behavior of the cold sprayed copper fine particles was observed precisely and the adhesive strength of the coating was evaluated. The deposition behavior of the sprayed individual copper particles on mirror polished stainless steel substrate was fundamentally investigated. The interface microstructure between sprayed particle and substrate revealed that an amorphous-like band region was recognized at interface during coating fabrication at high power conditions. For the deposition mechanism of the cold sprayed particles onto substrate surface, it was indicated that the deformation of the particles initially induce the destruction of its surface oxide and an appearance of the active fresh surface of the material may enhance the bonding between particles and substrate. On the other hand, in coating fabrication at high power condition, bonding between particle and substrate may be possibly formed via oxygen-rich amorphous-like layer at interface.

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Acknowledgments

This research was supported partly by the Grant-in-Aid for Scientific Research of the Ministry of Education, Science, Culture and Sports in Japan (#20360328). The authors want to acknowledge Dr. Y. Nakano for the TEM observation.

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Authors and Affiliations

  1. Department of Production Systems Engineering, Toyohashi University of Technology, Toyohashi, 441-8580, Japan

    M. Fukumoto, M. Mashiko & M. Yamada

  2. Shintobrator, Ltd., Kitanagoya, 450-0002, Japan

    E. Yamaguchi

Authors
  1. M. Fukumoto
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  2. M. Mashiko
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  3. M. Yamada
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  4. E. Yamaguchi
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Corresponding author

Correspondence to M. Fukumoto.

Additional information

This article is an invited paper selected from presentations at the 2009 International Thermal Spray Conference and has been expanded from the original presentation. It is simultaneously published in Expanding Thermal Spray Performance to New Markets and Applications: Proceedings of the 2009 International Thermal Spray Conference, Las Vegas, Nevada, USA, May 4-7, 2009, Basil R. Marple, Margaret M. Hyland, Yuk-Chiu Lau, Chang-Jiu Li, Rogerio S. Lima, and Ghislain Montavon, Ed., ASM International, Materials Park, OH, 2009.

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Fukumoto, M., Mashiko, M., Yamada, M. et al. Deposition Behavior of Copper Fine Particles onto Flat Substrate Surface in Cold Spraying. J Therm Spray Tech 19, 89–94 (2010). https://doi.org/10.1007/s11666-009-9426-y

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  • DOI: https://doi.org/10.1007/s11666-009-9426-y

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