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Dynamic Response Characteristics and Fatigue Life Prediction of Printed Circuit Boards for Random Vibration Environments

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Abstract

The study focuses on the analysis of the surface mounted components of the printed circuit boards (PCB) under random vibration loading. The surface mount technology used for the study involves ball grid arrays. In order to predict the fatigue life of the component under certain defense and automotive applications, modal analysis is done by using the finite element method. The results are verified experimentally using JEDEC standards to validate the finite element design used for the study, and random vibration experiments were performed with finite element analysis. The fatigue life of PCB under different random vibration environments is predicted and compared. The fatigue life of PCB is least with jet cargo environment and is maximum with rail cargo environment. The analysis reveals that under the jet cargo environment, more numbers of natural frequency excitations are present. It was found that upon loading, maximum stress was found to be induced at the corner of solder balls for packages mounted in the center of the PCB. Hence, it is suggested to incorporate design modification such that the central area of the PCB must not contain any packaging designs.

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Data Accessibility Statement

The raw/processed data required to reproduce these findings cannot be shared at this time as the data also forms part of an ongoing study.

Abbreviations

PCB:

Printed circuit board

BGA:

Ball grid array

FEM:

Finite element method

FEA:

Finite element analysis

CAD:

Computer aided design

PSD:

Power spectral density

FFT:

Fast Fourier Transform

IFFT:

Inverse Fast Fourier Transform

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Acknowledgments

This research received no specific grant from any funding agency in the public, commercial or not-for-profit sectors.

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Author notes

  1. S. G. S. Karthiheyan and Virendra Kumar Verma have contributed equally to this work.

Authors and Affiliations

  1. Department of Metallurgical and Materials Engineering, IIT Madras, Chennai, 600036, India

    S. G. S. Karthiheyan

  2. Department of Hydrogen Energy Systems, Graduate School of Engineering, Kyushu University, 744 Moto-oka, Nishi-ku, Fukuoka, 819-0395, Japan

    Virendra Kumar Verma

  3. Department of Production Engineering, PSG College of Technology, Coimbatore, 641004, India

    S. Saravanan, Karthik Sathiyaseelan & U. Gopinath

  4. Tautwell Learning Solutions India Pvt. Ltd., Chennai, 600015, India

    Venkateshwaran Pappiah Ayyappan

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  1. S. G. S. Karthiheyan
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Correspondence to Virendra Kumar Verma.

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Karthiheyan, S.G.S., Verma, V.K., Saravanan, S. et al. Dynamic Response Characteristics and Fatigue Life Prediction of Printed Circuit Boards for Random Vibration Environments. J Fail. Anal. and Preven. 20, 920–929 (2020). https://doi.org/10.1007/s11668-020-00895-w

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