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Growth of η phase scallops and whiskers in liquid tin-solid copper reaction couples

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Abstract

In the microelectronics industry, many solder junctions rely upon reaction between a copper substrate and a molten tin-based alloy. For the tin/copper system, interfacial continuity is afforded by the formation of the η (Cu6Sn5) and ɛ (Cu3Sn) phase intermetallic compounds. The η grows in a scalloped morphology along the tin interface with whiskers emanating from their tops. This article quantitatively describes the unusual growth behavior of the η phase scallops and whiskers formed during reaction of liquid tin with a solid copper substrate.

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Author information

Authors and Affiliations

  1. Northwestern University, USA

    Robert Gagliano (graduate student)

  2. graduate faculty at Northwestern University, USA

    Morris E. Fine (Technological Institute professor emeritus and member)

Authors
  1. Robert Gagliano
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  2. Morris E. Fine
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Additional information

For more information, contact R. Gagliano, Northwestern University, Department of Materials Science, 2225 N. Campus Drive, Evanston, Illinois 60208; e-mail r-gagliano@northwestern.edu.

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Gagliano, R., Fine, M.E. Growth of η phase scallops and whiskers in liquid tin-solid copper reaction couples. JOM 53, 33–38 (2001). https://doi.org/10.1007/s11837-001-0100-1

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  • DOI: https://doi.org/10.1007/s11837-001-0100-1

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