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Kejun Zeng is a senior packaging engineer with Texas Instruments in Dallas, Texas and is the advisor to JOM from the Electronic Packaging and Interconnection Materials Committee of the Electronic, Magnetic, & Photonic Materials Division of TMS.
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Zeng, K. Lead-free soldering: Materials science and solder joint reliability. JOM 61, 28 (2009). https://doi.org/10.1007/s11837-009-0084-9
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DOI: https://doi.org/10.1007/s11837-009-0084-9