Thermomechanical Behavior of Developmental Thermal Barrier Coating Bond Coats

Abstract

Thermal expansion, microtensile, and stress relaxation experiments have been performed to contrast and compare the thermal and mechanical response of two experimental (L1 and H1) coatings provided by Honeywell Corporation (Morristown, NY). Thermal expansion experiments reveal that both coatings have coefficients of thermal expansion (CTE) that vary with temperature and that the CTE mismatch between the coatings and superalloy substrate is significant in the case of L1 as compared to H1. Values of the 0.2% offset yield stress (YS), Young’s modulus (E), and hardening exponent (n) are reported. Room-temperature microtensile experiments show higher strain hardening and a very low value of failure strain for L1 as compared to H1. At elevated temperatures, there is a significant decrease in the YS of as-received L1 for (924 MPa at room temperature to 85 MPa at 1000°C) as compared to H1. Finally, a power law creep description for high-temperature stress relaxation is developed and the measured values of the stress exponent (n = 3) and activation energies (Q _creep = 200–250 kJ/mol) are shown to be consistent with power law creep.