Skip to main content
SpringerLink
Log in

Electrochemical migration behaviors of lead-free 64Sn-35Bi-1Ag solder on FR-4 PCB board plated with Cu

  • Published:
Wuhan University Journal of Natural Sciences

Abstract

Electrochemical migration (ECM) characteristic is a new reliability failure. A parallel surfacial electrode system coupling with scanning electron microscope (SEM), energy dispersive X-ray analysis (EDAX), and X-ray Diffraction (XRD) technologies is designed to research ECM behavior of 64Sn-35Bi-1Ag (SBA) solder in 3.5 g/L NaCl solution and compare to that of Sn37Pb and Sn-3.0Ag-0.5Cu (SAC) solders. Results show that SBA solder is more susceptible to ECM failure than Sn37Pb solder, which is more difficult than SAC solder. The affected factors of ECM are given as follows: the solder compositions, the loaded electric field, ECM time, etc. The electrochemical reaction mechanism of ECM process is achieved. EDAX and XRD analyses show that the main contents on dendrites of SBA solder after ECM test are Sn, hardly any Bi, a little Ag, which illustrates that the order of ion migration capacity is shown as follows: Sn>Ag>Bi.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Directive 2002/95/EC of the European Parliament and of the Council. On the restriction of the use of certain hazardous substances in electrical and electronic equipment [J]. Official Journal of the European Union, 2003, 23: 19–37.

    Google Scholar 

  2. Directive 2002/96/EC of the European Parliament and of the Council. On waste electrical and electronic equipment [J]. Official Journal of the European Union, 2003, 27: 24–37.

    Google Scholar 

  3. Xie Haiping, Yu Daquan, Ma haitao, et al. Microstructure, wettability and mechanical properties of Sn-Zn-Cu lead free solder [J]. The Chinese Journal of Nonferrous Metals, 2004, 14(10): 1694–1699.

    Google Scholar 

  4. Hua Li, Guo Xinpeng, Yang Jiakuan. Electrochemical corrosion behavior and dendrite growth of Sn-0.7Cu solder on FR-4 printed circuit board plated with Cu [J]. Journal of Chinese Society for Corrosion and Protection, 2010, 30(6): 469–474(Ch).

    Google Scholar 

  5. Bernard T, Bergmann H W, Haberling C, et al. Jointing technologies for Al-foam-Al-sheet compound structures [J]. Advanced Engineering Materials, 2002, 10(4): 798–802.

    Article  Google Scholar 

  6. Yi L, Wong C P, Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications [J]. Materials Science Engineering, 2006, R51: 1–35.

    Google Scholar 

  7. Shin B L, Young R Y, Ja Y J, et al. Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board [J]. Thin Solid Films, 2006, 504: 294–297.

    Article  Google Scholar 

  8. Tian Zongjun, Wang Guifeng, Huang Yinhui, et al. Fractal growth of Ni dendrite in electrodeposition [J]. The Chinese Journal of Nonferrous Metals, 2009, 19(1): 167–173(Ch).

    Google Scholar 

  9. Yu D Q, Jillek W, Schmitt E. Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water [J]. Journal of Materials Science: Materials in Electronics, 2006, 17(3): 219–227.

    Article  Google Scholar 

  10. Medqyes B, Illés B, Harsányi G, et al. Electrochemical migration behavior of Cu, Sn, Ag and Sn63/Pb37 [EB/OL].[2011-03-24]. http://www.springerlink.com/content/x50l383365514n75 .

  11. Barsoum M W, Hoffman E N, Doherty R D, et al. Driving force and mechanism for spontaneous metal whisker formation [EB/OL]. [2011-05-12]. http://prl.aps.org/abstract/PRL/v93/i20/e206104 .

  12. Oberndorff P, Dittes M, Crema P, et al. Whisker formation on matte Sn influencing of high humidity [EB/OL]. [2011-03-21]. http://www.engineeringvillage.com/controller/servlet/Controller?CID=quickSearchCitationFormat .

  13. Osenbach J W, Delucca J M, Potteiger B D, et al. Sn-whiskers: Truths and myths [J]. Journal of Materials Science: Materials in Electronics, 2007, 18(1/3): 283–305.

    Google Scholar 

  14. Chen Shurong, Fractal Study About Dendrite on Metal Electrodeposition Process [D]. Kunming: Library of Kunming University of Science and Technology, 2002(Ch).

    Google Scholar 

  15. Chai Jiqing. Sn-Bi Alloy plating in a low molting point, Electroplating and Pollution Control, 1996, 16(4): 10–12(Ch).

    Google Scholar 

  16. Hua L, Yang G. K, Zhang H Q. Effects of Ge doping on electrochemical migration, corrosion behavior and oxidation characteristics of lead-free Sn-3.0Ag-0.5Cu solder for electronic packaging [J]. Advanced Materials Research: in Advances in Superalloys, 2011, 146–147: 953–961.

    Article  Google Scholar 

  17. Li Zhuoran, Liu Bin, Feng Jicai. Optimum design of cadmium free siler-based filler metal contaed 20% Ag [J]. Transactions of The China Welding Institution, 2008, 29(8): 5–8(Ch).

    Google Scholar 

  18. Wei Guoqiang, Wan Zhonghua, Zhao Siyong, et al. Investigations on melting property, wettability and Mechanical property of Sn-XAg-0.5Cu lead-free solder alloys [J]. Material Science, 2010, 10: 53–56(Ch).

    Google Scholar 

  19. Liu Jing, Xu Jun, Zhang Fuwen, et al. Property of new type lead-free solder Sn-Ag-Cu-Cr-X [J]. Rare Metals, 2005, 29(5): 625–630(Ch).

    MathSciNet  Google Scholar 

  20. Hua Li, Guo Xingpeng, Yang Jiakuan, Effects of Bi doping on electrochemical corrosion and dendrite growth suppression of lead-free Sn-3.0Ag-0.5Cu solder [J]. The Chinese Journal of Nonferrous Metals, 2011, 51: 2274–2283(Ch).

    Google Scholar 

  21. Yang D, Chan Y C, Wu B Y, Electromigration and thermomigration behavior of flip chip solder joints in high current density packages [J]. Journal of Materials Research, 2008, 23(9): 2333–2339.

    Article  Google Scholar 

  22. Huang A T, Gusak A M, Tu K N, Thermomigration in SnPb composite flip chip solder joints [J]. Applied Physics Letters, 2006, 88(14): 1–3.

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. School of Chemistry and Life Science, Hubei University of Education, Wuhan, 430205, Hubei, China

    Li Hua & Hanna Hou

  2. School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan, 430074, Hubei, China

    Li Hua

Authors
  1. Li Hua
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Hanna Hou
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Li Hua.

Additional information

Foundation item: Supported by the National Natural Science Foundation of China (NSFC)(51171068), the Vital Fund from Hubei Provincial Department of Education ( C2010071), and the Fund of the Vital Subject Program on Applied Chemistry in Hubei University of Education

Biography: HUA Li, female, Post doctoral, Associate professor, research direction: new nanometer functional materials, the reliability and serve failure researches in micro/nanoelectronic packaging.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Hua, L., Hou, H. Electrochemical migration behaviors of lead-free 64Sn-35Bi-1Ag solder on FR-4 PCB board plated with Cu. Wuhan Univ. J. Nat. Sci. 17, 79–85 (2012). https://doi.org/10.1007/s11859-012-0808-5

Download citation

  • Received:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11859-012-0808-5

Key words

CLC number

Search

Navigation