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Efficient heat conducting liquid metal/CNT pads with thermal interface materials

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Abstract

Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity (\(\kappa \)) are indispensable components in thermal management systems. Here, we present a feasible method to fabricate heat conduction pads, which are composed of carbon nanotubes embedded into a liquid metal (LM). This setup has resulted in a large increase of \(\kappa \) reaching \(\sim \)14.2 \(\hbox {W mK}^{-1}\), greater than that of most of the commercial thermal silicone pads (\({\sim }5~\hbox {W mK}^{-1})\). In addition, a series of experiments were conducted on smartphones to evaluate the heat dissipation performance of the CPU. It turned out that LM/nanotube pads with TIMs show distinguish thermal conductivity performance.

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Acknowledgements

The authors acknowledge financial support from the National Science Foundation of China (Grant Nos. 11204097 and U1530120).

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Authors and Affiliations

  1. State Key Laboratory of Optoelectronic Materials and Technologies, School of Material Science and Engineering, Sun Yat-Sen University, Guangzhou, 510275, People’s Republic of China

    Liuying Zhao, Sheng Chu & Xuechen Chen

  2. School of Materials Science and Engineering, Sun Yat-Sen University, Guangzhou, 510275, People’s Republic of China

    Liuying Zhao & Sheng Chu

  3. School of Electronics and Information Technology, Sun Yat-Sen University, Guangzhou, 510275, People’s Republic of China

    Xuechen Chen

  4. School of Metallurgy and Environment, Central South University, Changsha, 410083, People’s Republic of China

    Guang Chu

Authors
  1. Liuying Zhao
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  2. Sheng Chu
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  4. Guang Chu
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Correspondence to Liuying Zhao.

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Zhao, L., Chu, S., Chen, X. et al. Efficient heat conducting liquid metal/CNT pads with thermal interface materials. Bull Mater Sci 42, 192 (2019). https://doi.org/10.1007/s12034-019-1872-7

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  • DOI: https://doi.org/10.1007/s12034-019-1872-7

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