Abstract
The interaction between Cu6Sn5 particles in the bulk of a solder and a Ni substrate was examined during solid-state aging using Cu/Sn/Ni and Cu/Sn/Cu/Sn/Ni diffusion couples with initially thin Cu layers. The results clearly demonstrated that the (Cu,Ni)6Sn5 particles dispersed in the bulk solder decomposed in order for a ternary (Cu1−xNix)6Sn5 layer to grow at the solder/Ni interface during solid-state aging. The interaction between the (Cu,Ni)6Sn5 particles and the (Cu1−xNix)6Sn5 layer occurs owing to the driving force for the (Cu,Ni)6Sn5 compound to become saturated with Ni. A (Ni,Cu)3Sn4 layer forms at the (Cu1−xNix)6Sn5/Ni interface only after the Ni composition of the (Cu,Ni)6Sn5 phase in the bulk solder approaches that of the (Cu1−xNix)6Sn5 layer. Once the (Ni,Cu)3Sn4 layer has formed, it grows at an exceptionally rapid rate by consuming the (Cu1−xNix)6Sn5 and Sn layers, which can be problematic in solder joint reliability.
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References
S. K. Kang, et al., Proc. 51st IEEE Electronic Components Technology Conf., p. 448 (2001).
J. W. Jang, D. R. Frear, T. Y. Lee, and K. N. Tu, J. Appl. Phys. 88, 6359 (2000).
S. K. Kang, R. S. Rai, and S. Purushothaman, J. Electron. Mater. 25, 1113 (1996).
C. E. Ho, R. Y. Tsai, Y. L. Lin, and C. R. Kao, J. Electron. Mater. 31, 584 (2002).
J. W. Yoon, S. W. Kim, and S. B. Jung, J. Alloy. Compd. 385, 192 (2004).
X. Q. Shi, H. F. Kwan, S. M. L. Nai, and G. H. Lim, J. Mater. Sci. 39, 1095 (2004).
W. C. Luo, C. E. Ho, J. Y. Tsai, Y. L. Lin, and C. R. Kao, Mater. Sci. Eng. A 396, 385 (2005).
Y. D. Jeon, J. W. Paik, A. Ostmann, and H. Reichl, J. Electron. Mater. 34, 80 (2005).
M. N. Islam and Y. C. Chan, Mater. Sci. Eng. B 117, 246 (2005).
H. T. Chen, C. Q. Wang, C. Yan, M. Y. Li, and Y. Huang, J. Electron. Mater. 36, 26 (2007).
Y. C. Chan, P. L. Tu, A. C. K. So, and J. K. L. Lai, IEEE Trans. Comp., Packag., Manufact. Technol. B 20, 463 (1997).
C. K. Shin, Y. J. Baik, and J. Y. Huh, J. Electron. Mater. 30, 1323 (2001).
S. K. Kang, W. K. Choi, M. J. Yim, and D. Y. Shih, J. Electron. Mater. 31, 1292 (2002).
F. Song and S. W. R. Lee, Proc. 56th IEEE Electronic Components Technology Conf., p. 1196 (2006).
C. W. Chang, S. C. Yang, C. T. Tu, and C. R. Kao, J. Electron. Mater. 36, 1455 (2007).
K. K. Hong, J. B. Ryu, C. Y. Park, and J. Y. Huh, J. Electron. Mater. 37, 61 (2008).
S. J. Wang and C. Y. Liu, J. Electron. Mater. 35, 1955 (2006).
F. Guo, J. Lee, S. Choi, J. P. Lucas, T. R. Bieler, and K. N. Subramanian, J. Electron. Mater. 30, 1073 (2001).
A. M. Minor and J. W. Morris, Metall. Mater. Trans. A 31, 798 (2000).
M. O. Alam, Y. C. Chan, and K. N. Tu, J. Mater. Res. 18, 2562 (2003)
C. W. Chang, C. E. Ho, S. C. Yang, and C. R. Kao, J. Electron. Mater. 35, 1948 (2006).
C. E. Homer and H. Plummer, J. Inst. Met. 64, 169 (1939).
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Chung, BM., Hong, KK. & Huh, JY. Decomposition of Cu6Sn5 particles in solder for the growth of a ternary (Cu1−xNix)6Sn5 layer on a Ni substrate. Met. Mater. Int. 15, 487–492 (2009). https://doi.org/10.1007/s12540-009-0487-8
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DOI: https://doi.org/10.1007/s12540-009-0487-8