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Effect of sintering temperature on the microstructure and thermal conductivity of Al/diamond composites prepared by spark plasma sintering

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Abstract

Spark plasma sintering was used to fabricate Al/diamond composites. The effect of sintering temperature on the microstructure and thermal conductivity (TC) of the composites was investigated with the combination of experimental results and theoretical analysis. The composite sintered at 550°C shows high relative density and strong interfacial bonding, whereas the composites sintered at lower (520°C) and higher (580–600°C) temperatures indicate no interfacial bonding and poor interfacial bonding, respectively. High relative density and strong interfacial bonding can maximize the thermal conductivity of Al/diamond composites, and taking both effects of particle shape and inhomogeneous interfacial thermal conductance into consideration can give a fairly good prediction of composites’ thermal conduction properties.

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Authors and Affiliations

  1. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, China

    Ke Chu, Cheng-chang Jia, Xue-bing Liang & Hui Chen

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  1. Ke Chu
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  2. Cheng-chang Jia
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  3. Xue-bing Liang
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  4. Hui Chen
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Correspondence to Ke Chu.

Additional information

This work was financially supported by the National Natural Science Foundation of China (No.50971020).

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Chu, K., Jia, Cc., Liang, Xb. et al. Effect of sintering temperature on the microstructure and thermal conductivity of Al/diamond composites prepared by spark plasma sintering. Int J Miner Metall Mater 17, 234–240 (2010). https://doi.org/10.1007/s12613-010-0220-0

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  • DOI: https://doi.org/10.1007/s12613-010-0220-0

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