Abstract
The evolutionary process and intermetallic compounds of Cu/Al couples during isothermal heating at a constant bonding temperature of 550°C were investigated in this paper. The interfacial morphologies and microstructures were examined by optical microscopy, scanning electron microscopy equipped with energy dispersive X-ray spectroscopy, and X-ray diffraction. The results suggest that bonding is not achieved between Cu and Al at 550°C in 10 min due to undamaged oxide films. Upon increasing the bonding time from 15 to 25 min, however, metallurgical bonding is obtained in these samples, and the thickness of the reactive zone varies with holding time. In the interfacial region, the final microstructure consists of Cu9Al4, CuAl, CuAl2, and α-Al + CuAl2. Furthermore, these results provide new insights into the mechanism of the interfacial reaction between Cu and Al. Microhardness measurements show that the chemical composition exerts a significant influence on the mechanical properties of Cu/Al couples.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
Y.J. Guo, G.J. Qiao, W.Z. Jian, and X.H. Zhi, Microstructure and tensile behavior of Cu-Al multi-layered composites prepared by plasma activated sintering, Mater. Sci. Eng. A, 527(2010), No. 20, p. 5234.
M. Abbasi, A.K. Taheri, and M.T. Salehi, Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process, J. Alloys Compd., 319(2001), No. 1–2, p. 233.
C.Y. Chen and W.S. Hwang, Effect of annealing on the interfacial structure of aluminum-copper joints, Mater. Trans., 48(2007), No. 7, p. 1938.
G. Heness, R. Wuhrer, and W.Y. Yeung, Interfacial strength development of roll-bonded aluminium/copper metal laminates, Mater. Sci. Eng. A, 483–484(2008), p. 740.
X.B. Li, G.Y. Zu, M.M. Ding, Y.L. Mu, and P. Wang, Interfacial microstructure and mechanical properties of Cu/Al clad sheet fabricated by asymmetrical roll bonding and annealing, Mater. Sci. Eng. A, 529(2011), p. 485.
Y. Funamizu and K. Watanabe, Interdiffusion in Al-Cu system, Trans. Jpn. Inst. Met., 12(1971), No. 3, p. 147.
Y.J. Guo, G.W. Liu, H.Y. Jin, Z.Q. Shi, and G.J. Qiao, Intermetallic phase formation in diffusion-bonded Cu/Al laminates, J. Mater. Sci., 46(2011), No. 8, p. 2467.
C.Y. Chen, H.L. Chen, and W.S. Hwang, Influence of interfacial structure development on the fracture mechanism and bond strength of aluminum/copper bimetal plate, Mater. Trans., 47(2006), No. 4, p. 1232.
W.B. Lee, K.S. Bang, and S.B. Jung, Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing, J. Alloys Compd., 390(2005), No. 1–2, p. 212.
K. Meguro, M.O, and M. Kajihara, Growth behavior of compounds due to solid-state reactive diffusion between Cu and Al, J. Mater. Sci., 47(2012), No. 12, p. 4955.
H. Kawakami, J. Suzuki, and J. Nakajima, Bonding process of Al/Cu dissimilar bonding with liquefaction in air, Weld. Int., 21(2007), No. 12, p. 836.
M. Divandari and J. Campbell, A new technique for the study of aluminum oxide films, Alum. Trans., 2(2000), No. 2, p. 233.
G.F. Zhang, J.X. Zhang, Y. Pei, S.Y. Li, and D.L. Chai, Joining of Al2O3p/Al composites by transient liquid phase (TLP) bonding and a novel process of active-transient liquid phase (A-TLP) bonding, Mater. Sci. Eng. A, 488(2008), No. 1–2, p. 146.
X.Y. Gu, D.Q. Sun, L. Liu, and Z.Z. Duan, Microstructure and mechanical properties of transient liquid phase bonded TiCP/AZ91D joints using copper interlayer, J. Alloys Compd., 476(2009), No. 1–2, p. 492.
Y.Y. Qian, Z.G. Dong, and F. Gao, Microstructure development and metallurgical analysis of the Al-Si contact reaction, J. Mater. Process. Technol., 122(2002), No. 2–3, p. 305.
F.A. Calvo, A. Ureng, J.M. Gomez De Salazar, and F. Molleda, Special features of the formation of the diffusion bonded joints between copper and aluminium, J. Mater. Sci., 23(1988), No. 6, p. 2273.
G.Q. Wu, Z.F. Li, G.X. Luo, H.Y. Li, and Z. Huang, Dynamic simulation of solid-state diffusion bonding, Mater. Sci. Eng. A, 452–453(2007), p. 529.
Y.J. Su, X.H. Liu, H.Y. Huang, X.F. Liu, and J.X. Xie, Interfacial microstructure and bonding strength of copper cladding aluminum rods fabricated by horizontal core-filling continuous casting, Metall. Mater. Trans. A, 42(2011), No. 13, p. 4088.
P. Xue, B.L. Xiao, D.R. Ni, and Z.Y. Ma, Enhanced mechanical properties of friction stir welded dissimilar Al-Cu joint by intermetallic compounds, Mater. Sci. Eng. A, 527(2010), No. 21–22, p. 5723.
C.W. Tan, Z.G. Jiang, L.Q. Li, Y.B. Chen, and X.Y. Chen, Microstructural evolution and mechanical properties of dissimilar Al-Cu joints produced by friction stir welding, Mater. Des., 51(2013), p. 466.
H. Xu, C. Liu, V.V. Silberschmidt, S.S. Pramana, T.J. White, Z. Chen, and V.L. Acoff, Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds, Acta Mater., 59(2011), No. 14, p. 5661.
G.R. Zare, M. Divandari, and H. Arabi, Investigation on interface of Al/Cu couples in compound casting, Mater. Sci. Technol., 29(2013), No. 2, p. 190.
J.A. Warren, T. Pusztai, L. Környei, and L. Gránásy, Phase field approach to heterogeneous crystal nucleation in alloys, Phys. Rev. B, 79(2009), p. 4204.
D. Moreno, J. Garrett, and J.D. Embury, A technique for rapid characterization of intermetallics and interfaces, Intermetallics, 7(1999), No. 9, p. 1001.
J.F. Li, P.A. Agyakwa, and C.M. Johnson, Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process, Acta Mater., 59(2011), No. 3, p. 1198.
M.S. Park, S.L. Gibbons, and R. Arróyave, Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions, Acta Mater., 60(2012), No. 18, p. 6278.
M. Aravind, P. Yu, M.Y. Yau, and Dickon H.L. Ng, Formation of Al2Cu and AlCu intermetallics in Al(Cu) alloy matrix composites by reaction sintering, Mater. Sci. Eng. A, 380(2004), No. 1–2, p. 384.
M. Eizadjou, A.K. Talachi, H.D. Manesh, H.S. Shahabi, and K. Janghorban, Investigation of structure and mechanical properties of multi-layered Al/Cu composite produced by accumulative roll bonding (ARB) process, Compos. Sci. Technol., 68(2008), No. 9, p. 2003.
G.H. Min, J.M. Lee, S.B. Kang, and H.W. Kim, Evolution of microstructure for multilayered Al/Ni composites by accumulative roll bonding process, Mater. Lett., 60(2006), No. 27, p. 3255.
K.J.M. Papis, B. Hallstedt, J.F. Löffler, and P.J. Uggowitzer, Interface formation in aluminium-aluminium compound casting, Acta Mater., 56(2008), No. 13, p. 3036.
E. Hug and N. Bellido, Brittleness study of intermetallic (Cu, Al) layers in copper-clad aluminium thin wires, Mater. Sci. Eng. A, 528(2011), No. 22–23, p. 7103.
F. Ji and S.B. Xue, Growth behaviors of intermetallic compound layers in Cu/Al joints brazed with Zn-22Al and Zn-22Al-0.05Ce filler metals, Mater. Des., 51(2013), p. 907.
C.C. Hsieh, M.S. Shi, and W. Wu, Growth of intermetallic phases in Al/Cu composites at various annealing temperatures during the ARB process, Met. Mater. Int., 18(2012), No. 1, p. 1.
M. Braunovic and N. Alexandrov, Intermetallic compounds at aluminum-to-copper electrical interfaces: effect of temperature and electric current, IEEE Trans. Compon. Packag. Manuf. Technol. Part A, 17(1994), No. 1, p. 78.
Author information
Authors and Affiliations
Corresponding author
Additional information
This article is published with open access at SpringerLink.com
Rights and permissions
Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made.
The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder.
To view a copy of this licence, visit https://creativecommons.org/licenses/by/4.0/.
About this article
Cite this article
Han, Yq., Ben, Lh., Yao, Jj. et al. Investigation on the interface of Cu/Al couples during isothermal heating. Int J Miner Metall Mater 22, 309–318 (2015). https://doi.org/10.1007/s12613-015-1075-1
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s12613-015-1075-1