Abstract
The effect of polyamideimide (PAI) content on the cure behaviors and thermal stabilities of 4,4′-tetraglycidyl diaminodiphenyl methane (TGDDM) epoxy resin/polyamideimide (PAI) blends was investigated. The experimental results revealed that the main exothermic peak and cure activation energy (E a ) of the blends decreased with increasing PAI content, presumably because the curing reaction was accelerated by the presence of secondary amine groups of the PAI backbone. The decomposition activation energy (E d ) of the blends was maximized at 5 phr PAI and decreased above this content; this was attributed to the short-chain structural network in TGDDM/PAI blends, which was derived from etherification and chain-scission reactions caused by the secondary amine of PAI.
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Park, SJ., Heo, GY. & Jin, FL. Cure behaviors and thermal stabilities of tetrafunctional epoxy resin toughened by polyamideimide. Macromol. Res. 23, 320–324 (2015). https://doi.org/10.1007/s13233-015-3051-z
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DOI: https://doi.org/10.1007/s13233-015-3051-z