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Thermal Performance of Low-Melting-Temperature Alloy Thermal Interface Materials

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Acta Metallurgica Sinica (English Letters) Aims and scope

Abstract

Thermal resistance of low-melting-temperature alloy (LMTA) thermal interface materials (TIMs) was measured by laser flash method before and after different stages of heating. The results showed that the thermal performance of the LMTA TIMs was degraded during the heating process. It is suggested that the degradation may mainly be attributed to the interfacial reaction between the Cu and the molten LMTAs. Due to the fast growth rate of intermetallic compound (IMC) at the solid–liquid interface, a thick brittle IMC is layer formed at the interface, which makes cracks easy to initiate and expand. Otherwise, the losses of indium and tin contents in the LMTA during the interfacial reaction will make the melting point of the TIM layer increase, and so, the TIM layer will not melt at the operating temperature.

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References

  1. F. Sarvar, D.C. Whalley, P.P. Conway, Thermal interface materials—a review of the state of the art. Paper present at electronics system integration technology conference, Dresden, 2006, pp. 1292–1302

  2. R. Prasher, Proc. IEEE 94, 1571 (2006)

    Article  Google Scholar 

  3. R.S. Cook, K.H. Token, U.S. Patent 4,384,610, 1983

  4. G.L. Lehman, D.A. Davidson, in Proceedings of the Pacific Rim Int. Intersociety, Electronic Packaging Conference (IPACK’01), Kauai, Hawaii, 8—13 July, 2001, No. 15890

  5. R.L. Webb and J.P. Gwinn, Low melting point thermal interface material. Paper present at ITherm 2002—8th intersociety conference on thermal and thermomechanical phenomena in electronic systems, San Diego, CA, 30 May—2 June 2002, pp. 671–676

  6. C.G. Macris, T.R. Sanderson, R.G. Ebel, C.B. Leyerle, Performance, reliability, and approaches using a low melt alloy as a thermal interface material. Paper presented at IMAPS 2004 (37th international symposium on microelectronics), long Beach, 14–18 November 2004

  7. J.P. Gwinn, R.L. Webb, Microelectron. J. 34, 215 (2003)

    Article  Google Scholar 

  8. C.G. Macris, T.R. Sanderson, R.G. Ebel, C.B. Leyerle. Processor performance, packaging and reliability utilizing a phase change metallic alloy thermal interface system. Paper present at IMAPS 2005 (38th international symposium on microelectronics), Philadelphia, 25—29 September 2005

  9. J.D. Guo, G.H. He, Y.Y. Zhang, B.L. Zhou, Int. J. Thermophys. 21, 479 (2000)

    Article  Google Scholar 

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Acknowledgments

This work was supported by the National Basic Research Program of China (No. 2010CB631006), and the National Natural Science Foundation of China (No. 51171191).

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Authors and Affiliations

  1. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China

    E. Yang, Hongyan Guo, Jingdong Guo & Jianku Shang

  2. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA

    Jianku Shang

  3. College of Sciences, Northeastern University, Shenyang, 110189, China

    E. Yang & Mingguang Wang

Authors
  1. E. Yang
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  2. Hongyan Guo
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  3. Jingdong Guo
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  4. Jianku Shang
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Correspondence to Jingdong Guo.

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Yang, E., Guo, H., Guo, J. et al. Thermal Performance of Low-Melting-Temperature Alloy Thermal Interface Materials. Acta Metall. Sin. (Engl. Lett.) 27, 290–294 (2014). https://doi.org/10.1007/s40195-014-0042-6

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  • DOI: https://doi.org/10.1007/s40195-014-0042-6

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