Approximate evaluation of the interfacial shearing stress in cylindrical double lap shear joints with application to dual-coated optical fibers
References (17)
Approximate evaluation of the elastic interfacial stresses in thin films, with application to high-Tc superconducting ceramics
Int. J. Solids Structures
(1991)Thermal stresses in a rectangular plate clamped along an edge
ASME J. Appl. Mech.
(1949)Thermal contact stresses of bi-metal strip thermostat
Appl. Math. Mech.
(1983)- et al.
Thermal stress in bonded joints
IBM J. Res. Dev.
(1979) An analysis of adhesive-bonded single-lap joints
ASME J. Appl. Mech.
(1983)- et al.
The stresses in cemented joints
ASME J. Appl. Mech.
(1944) Interlaminar thermoelastic stresses in layered beams
J. Thermal Stresses
(1978)- et al.
Simplified engineering approach for the evaluation of thermally induced stresses in bi-material microelectronic structures
There are more references available in the full text version of this article.
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An experimental and analytical study of the mechanical behaviour of adhesively bonded joints for variable extension rates and temperatures
2008, International Journal of Adhesion and AdhesivesA unified approach to geometrically nonlinear analysis of tapered bonded joints and doublers
2006, International Journal of Solids and StructuresCitation Excerpt :Single sided bonded doublers and single strap joints are also recently analyzed by Hart-Smith (2004), accounting for the effect of thermal mismatch. Recent works by Oplinger (1994), Suhir (1994), Tsai et al. (1998) refined the above earlier models by removing deficient assumptions and accounting for additional important effects such in adherend shear deformation or large adherend deflection. However, except for the Hart-Smith step joint model (1973c), all of these theoretical works were limited to untapered adherends and also were usually restricted to joints of identical (balanced) adherends.
Adhesively bonded assemblies with identical nondeformable adherends and 'piecewise continuous' adhesive layer: Predicted thermal stresses in the adhesive
2000, International Journal of Solids and StructuresImproved theoretical solutions for adhesive lap joints
1998, International Journal of Solids and StructuresAvoiding inelastic strains in solder joint interconnections of ic devices
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2019, Journal of Applied Mechanics, Transactions ASME
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