Microstructure and segregation in splat-cooled aluminum-copper alloy

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Abstract

Several Al-4.5 wt% Cu alloy specimens were levitated and splat-cooled under various processing conditions. Among the processing variables affecting microstructure, the dropping temperature appeared to be very important. The microstructure of foils obtained by splat-cooling droplets in the liquid-solid range was duplex with coarse dendrite cells embedded in a fine rod-like dendritic structure. In foils obtained by splat-cooling superheated droplets the fine rod-like dendritic structure was sometimes interrupted at the middle of the foil by a fine equiaxed dendritic structure. Microsegregation in splat-cooled foils, expressed as volume fraction of nonequilibrium interdendritic secondary phase θ-Al2Cu, was about 50% lower than in a regular casting.

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