Elastic characterization of diamond films by acoustic microscopy

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Abstract

As the development of diamond-like films (DLFs) progresses and emerges from the research environment, the need for rapid, large-scale non-destructive inspection becomes ever more important. The metrology or reflectometer mode of the acoustic microscope is used to inspect the layered structure consisting of DLFs deposited on silicon substrates. A measured acoustic material signature (AMS) for DLF on silicon is used to determine the surface acoustic wave (SAW) velocity and the dispersion in the layered substrate. The variation of the measured SAW dispersion with film parameters, obtained in a completely non-destructive manner, may then be used to ascertain the film quality, such as film thickness, adhesion and texture. In the particular example of a DLF on a silicon substrate, the SAW velocity increases with frequency and film thickness (positive dispersion). The physics of the metrology mode (AMS) is described and applied to the determination of important film quantities in layered structures of gold and DLF on silicon. The measured SAW velocities of DLF on two crystalline orientations of silicon and with film thickness between 0.7 and 9.0 μm are reported at frequencies up to 600 MHz. These are compared with computed SAW dispersion based on the bulk properties of diamond. A preliminary interpretation of these results and the implications for material properties of these films are presented.

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