Surface/subsurface damage and the fracture strength of ground ceramics

doi:10.1016/0924-0136(95)02090-X

Journal of Materials Processing Technology

Volume 57, Issues 3–4, 15 February 1996, Pages 207-220

https://doi.org/10.1016/0924-0136(95)02090-X Get rights and content

Abstract

This paper examines published works related to surface/subsurface damage and the fracture strength of ground structural ceramics over the last 20 years. Consistent as well as conflicting experimental observations concerning grinding-induced microcracks, residual stresses and the degradation of flexure strength are summarized. Special attention is paid to the quantified relationships between the grinding variables, machining damage and the flexure strength of ground ceramics because of the importance of these relationships for optimizing the ceramics grinding processes. Several issues such as non-uniformity of the grinding interface, crack measurement, thermal effects and microstructural features are discussed and highlighted as future research areas for better modeling and simulation of ceramics grinding operations.

References (90)

V.E Annamalai et al.
Grinding of transformation toughening ceria stabilized tetragonal zirconia polycrystals
J. Mater. Process. Technol.
(1994)
E Brinksmeier
State-of-the-art of nondestructive measurement of sub-surface material properties and damage
Precis. Eng.
(1989)
C Tsutsumi et al.
High quality machining of ceramics
J. Mater. Process. Technol.
(1993)
T.M.A Maksoud et al.
Grinding of ceramics: the effect on their strength properties
J. Mater. Process. Technol.
(1994)
I Inasaki
Speed-stroke grinding of advanced ceramics
Ann. CIRP
(1988)
I Inasaki
Grinding of hard and brittle materials
Ann. CIRP
(1987)
T Nakajima et al.
Cutting mechanism of fine ceramics with a single point diamond
Precis. Eng.
(1989)
A.A Moftakhar et al.
Calculation of stress intensity factors by efficient integration of weight functions
Eng. Fract. Mech.
(1992)
K Kitajima et al.
Study on mechanism of ceramic grinding
Ann. CIRP
(1992)
A Krell et al.
Response of polycrystalline Al₂O₃ to diamond grinding
Wear
(1984)

M.M Schwartz

T Abraham

Current US markets for advanced ceramics and projections for future growth

S Malking et al.

Grinding mechanism and strength degradation for ceramics

J. Eng. Ind.

(1989)

R.W Rice et al.

The nature of strength controlling machining flaws in ceramics

R.W Rice et al.

The effect of grinding direction on flaw character and strength of single crystal and polycrystalline ceramics

J. Mater. Sci.

(1981)

E Saljé et al.

Material removal in grinding of advanced ceramics

B Zhang et al.

Study on surface cracking of alumina scratched by single-point diamonds

J. Mater. Sci.

(1988)

H.P Kirchner

Damage penetration at elongated machining grooves in hot-pressed Si₃N₄

J. Am. Ceram. Soc.

(1984)

C.C Wu et al.

The effect of surface finishing on the strength of commercial hot pressed Si₃N₄

R.L Allor et al.

Influence of machining on strength properties of turbine materials

M.B Thomas et al.

A study of selected grinding parameters on the surface finish and strength of hot pressed silicon nitride

P.H.J van den Berg et al.

Strength and residual stress of Mg-PSZ after grinding

Wear

(1994)

J.E Shemilt et al.

Investigation of the influence of machining on the fracture of engineering ceramics

J. Mater. Sci. Lett.

(1994)

S Jahanmir et al.

Effect of grinding on strength integrity of silicon nitride: Part I

S Jahanmir et al.

Effect of grinding on strength and surface integrity of silicon nitride: Part II

W.D Friedman et al.

An assessment of various methods which detect critical surface flaws in sintered SiC

H.K Tönshoff et al.

Evaluation of surface layers of machined ceramics

Ann. CIRP

(1989)

T Horikawa et al.

Surface property and strength of ground alumina ceramics

J. Soc. Mater. Sci., Jpn

(1992)

D.J Green et al.

Factors influencing residual surface stresses due to a stress-induced phase transformation

J. Am. Ceram. Soc.

(1983)

S Chandrasekar et al.

An investigation into the mechanics of diamond grinding of brittle materials

R Samule et al.

Effect of residual stresses on the fracture of ground ceramics

J. Am. Ceram. Soc.

(1989)

F.F Lange et al.

Determination of residual surface stresses caused by grinding in polycrystalline Al₂O₃

J. Am. Ceram. Soc.

(1983)

B Eigenmann et al.

Determination of residual stresses in ceramics and ceramic-metal composites by X-ray diffraction methods

Mater. Sci. Eng.

(1987)

Z.Q Kang et al.

Stress correction for removal of material in X-ray stress determination

J. Test. Eval.

(1994)

K Tanaka et al.

X-ray residual stress measurement of sintered silicon carbide

Y Ahn et al.

Measurement of residual stresses in machined ceramics using the indentation technique

W Pfeiffer

Characterization of near-surface conditions of machined ceramics by use of X-ray residual stress measurements

W Pfeiffer et al.

Strength properties of surface machined components of structural ceramics

H.G Wobker et al.

High efficiency grinding of structural ceramics

W Pfeiffer

Influence of machining-induced residual stresses on the strength of ceramics

H Yoshida et al.

X-ray measurement of grinding residual stress in alumina ceramics

T Pradell et al.

Determination of residual stresses caused by grinding of silicon nitride ceramics

H.K Tönshoff et al.

P Roth et al.

Influence of microstructure on grindability of alumina ceramics

K Murata et al.

An approach to residual stress in the ground layer of ceramics from material removal by grinding

J. Soc. Mater. Sci., Jpn

(1992)

Cited by (137)

Atomistic simulation on the removal mechanism of monocrystal silicon carbide with textured surface nano-machining in water lubrication
2023, Journal of Manufacturing Processes
A new machining method that combines textured surface and water lubrication is proposed in this paper to improve the friction characteristics of ground silicon carbide (SiC). The effects of water film thickness and grinding speed on the nano-machining behavior of monocrystal cubic SiC are revealed using molecular dynamics simulation. Moreover, a Rayleigh chip thickness model is employed to predict surface roughness. According to the obtained results, friction characteristics and machinability of textured samples are strengthened compared with the non-textured sample. Behavior characteristics are further improved in water-lubricated conditions, which show that the temperature, grinding force, and friction coefficient decrease, while the hydrostatic stress and the von Mises stress increase. Therefore, tool wear and sub-surface damage are improved. Furthermore, an improved material removal performance is also achieved under high-speed grinding. Lastly, it is observed that surface roughness of ground SiC is improved in water lubrication and under high-speed grinding.
Damage behavior and removal mechanism of different yarn orientations 2.5D SiC<inf>f</inf>/SiC composites under single-abrasive scratch test
2022, Ceramics International
This study aims to comprehensively investigate the effects of yarn orientation and grinding depth on the damage behavior and removal mechanism of 2.5D SiC_f/SiC composites via single-abrasive scratch tests. Results show that brittle matrix damage and fiber fracture are the primary removal modes of the composites. As the scratching depth increases, the fiber fracture removal modes of warp yarns are cutting fracture, cutting and shear fracture, and shear fracture, whereas those of weft yarns are cutting fracture, shear fracture, and bending fracture. The matrix is primarily removed via cracking, damage, and peeling. The resulting debris is composed of fiber segments, fiber microsegments, interface fragments, matrix fragments, and microdebris. The scratching force and cross-sectional area gradually increase with increasing scratching depth; however, the specific scratching energy decrease. This study clarifies the damage behavior and removal mechanism of 2.5D SiC_f/SiC composites and provides meaningful guidance for improving processing quality.
Understanding the machining characteristic of plain weave ceramic matrix composite in ultrasonic-assisted grinding
2022, Ceramics International
The machining of silicon carbide (SiC) ceramic matrix composites is a significant challenge because of the severe material damage that may occur during material removal, which might shorten the service life of the composite parts. In this study, the effects of different fibre orientations of two-dimensional woven carbon-fibre-reinforced silicon carbide matrix composites (2D-C_f/SiC) on the grinding force, surface roughness, and surface/subsurface micromorphology were investigated to clarify the material removal and breakage mechanism in ultrasonic-assisted grinding of ceramic matrix composites. The results show that the predominant material removal mode in ultrasonic-assisted grinding is brittle fracture. The forms of material breakage are matrix cracking, fibre fracture, fibre pull-out, interfacial debonding, and interfacial fracture. Compared with conventional grinding, the normal force, tangential force, and surface roughness in ultrasonic-assisted grinding decreased by approximately 20%, 18%, and 9%, respectively. The machining parameters significantly impacted the grinding force and surface roughness. The material removal modes varied for different fibre orientations. Ultrasonic-assisted grinding can effectively decrease the grinding force and improve the surface integrity. The findings of this study can be applied to predict the grinding force and surface integrity of 2D-C_f/SiC and contribute to the design and manufacturing of this type of material.
Morphology evolution of Vickers indentation in fused silica glass etched by atmospheric pressure plasma jet
2022, Ceramics International
Nondestructive machining of optical components and smoothing of surface/subsurface damage generated by pre-processing is a major challenge for ultra-tight machining. The study analyzes the crack change during smoothing by quantitative layer-by-layer removal of Vickers indentations through atmosphere pressure plasma jet; the indentation change process is modeled and analyzed using Level Set Method (LSM) simulation. The results show that plasma jet processing can smooth the subsurface damage of fused silica optical components, and the LSM simulation verifies that the processing of cracks in fused silica components by plasma jet is dominated by each isotropic etching, and there are also each anisotropic etching during the change of cracks; and the depth of adjacent cracks can be judged by the moving direction of adjacent crack boundaries.
Study on the subsurface damage mechanism of optical quartz glass during single grain scratching
2021, Ceramics International
The single grain scratching SPH simulation model was established to study the subsurface damage of optical quartz glass. Based on the analysis of the stress, strain and scratching force during scratching, the generation and propagation of subsurface cracks were studied by combining with the scratch elastic stress field model. The simulation results show that the cracks generate firstly at the elastic-plastic deformation boundary in front of the grain (φ = 28°) due to the influence of the maximum principal tensile stress. During the scratching process, the median crack closes to form the subsurface damage by extending downward, the lateral crack promotes the brittle removal of the material by extending upward to the free surface, and microcracks remain in the elastic-plastic boundary at the bottom of the scratch after scratching. The depth of subsurface crack and plastic deformation increases with rising scratching depth. The increase of scratching speed leads to the greater dynamic fracture toughness, accompanied by a significant decrease of the maximum depth of subsurface crack and the number of subsurface cracks. The subsurface residual stress is concentrated at the bottom of the scratch, and the residual stress on both sides of the scratch surface would generate and propogate the Hertz crack. When the scratching depth is less than 1.5 μm or the scratching speed is greater than 75 m/s, the residual stress value and the depth of residual stress are relatively small. Finally, the scratching experiment was carried out. The simulation analysis is verified to be correct, as the generation and propagation of the cracks in the scratching experiment are consistent with the simulation analysis and the experimental scratching force indicates the same variation tendency with the simulation scratching force. The research results in this paper could help to restrain the subsurface damage in grinding process.
Engineered net shaping of alumina ceramics using picosecond laser
2021, Optics and Laser Technology
Traditional machining techniques pose significant drawbacks when applied to ceramics due to the material’s inherent brittleness. Specialized laser machining has been known to solve these issues through higher precision and micrometer-scale feature control. In this study, a picosecond fiber laser has been proposed as a near-net shaping material removal system for different engineering applications of industrial grade alumina ceramics with a variety of thicknesses and feature dimensions. This article particularly focuses on optimizing picosecond laser processing parameters (i.e., wobble amplitude, wobble frequency, wobble pitch, linear speed and number of passes) that were implemented to obtain ablated, deep, smooth and defect-free designed cut geometries (i.e., kerf taper and cut depth) with a high degree of precision. The surface roughness was assessed to determine the quality of the cuts. The optimal process parameters between the quality and material removal rate were introduced. Using a circular wobble laser pattern, it was determined that a greater cut depth can be achieved at lower linear speeds and wobble frequencies due to the higher linear energy density. It has also been found that the kerf taper is dependent on the cut depth and wobble amplitude, where the measured cuts follow the geometric relation between these parameters accurately. In addition, a maximum material removal rate of ~ 10 mm³/min was achieved to make a desired ablated cut profile in the alumina ceramic tiles as thick as 2.54 mm (0.1 in).

View all citing articles on Scopus

View full text

ReviewSurface/subsurface damage and the fracture strength of ground ceramics

Abstract

J. Mater. Process. Technol.

Precis. Eng.

J. Mater. Process. Technol.

J. Mater. Process. Technol.

Ann. CIRP

Ann. CIRP

Precis. Eng.

Eng. Fract. Mech.

Ann. CIRP

Wear

Current US markets for advanced ceramics and projections for future growth

Grinding mechanism and strength degradation for ceramics

J. Eng. Ind.

The nature of strength controlling machining flaws in ceramics

The effect of grinding direction on flaw character and strength of single crystal and polycrystalline ceramics

J. Mater. Sci.

Material removal in grinding of advanced ceramics

Study on surface cracking of alumina scratched by single-point diamonds

J. Mater. Sci.

Damage penetration at elongated machining grooves in hot-pressed Si3N4

J. Am. Ceram. Soc.

The effect of surface finishing on the strength of commercial hot pressed Si3N4

Influence of machining on strength properties of turbine materials

A study of selected grinding parameters on the surface finish and strength of hot pressed silicon nitride

Strength and residual stress of Mg-PSZ after grinding

Wear

Investigation of the influence of machining on the fracture of engineering ceramics

J. Mater. Sci. Lett.

Effect of grinding on strength integrity of silicon nitride: Part I

Effect of grinding on strength and surface integrity of silicon nitride: Part II

An assessment of various methods which detect critical surface flaws in sintered SiC

Evaluation of surface layers of machined ceramics

Ann. CIRP

Surface property and strength of ground alumina ceramics

J. Soc. Mater. Sci., Jpn

Factors influencing residual surface stresses due to a stress-induced phase transformation

J. Am. Ceram. Soc.

An investigation into the mechanics of diamond grinding of brittle materials

Effect of residual stresses on the fracture of ground ceramics

J. Am. Ceram. Soc.

Determination of residual surface stresses caused by grinding in polycrystalline Al2O3

J. Am. Ceram. Soc.

Determination of residual stresses in ceramics and ceramic-metal composites by X-ray diffraction methods

Mater. Sci. Eng.

Stress correction for removal of material in X-ray stress determination

J. Test. Eval.

X-ray residual stress measurement of sintered silicon carbide

Measurement of residual stresses in machined ceramics using the indentation technique

Characterization of near-surface conditions of machined ceramics by use of X-ray residual stress measurements

Strength properties of surface machined components of structural ceramics

High efficiency grinding of structural ceramics

Influence of machining-induced residual stresses on the strength of ceramics

X-ray measurement of grinding residual stress in alumina ceramics

Determination of residual stresses caused by grinding of silicon nitride ceramics

Influence of microstructure on grindability of alumina ceramics

An approach to residual stress in the ground layer of ceramics from material removal by grinding

J. Soc. Mater. Sci., Jpn

Review
Surface/subsurface damage and the fracture strength of ground ceramics

Damage penetration at elongated machining grooves in hot-pressed Si₃N₄

The effect of surface finishing on the strength of commercial hot pressed Si₃N₄

Determination of residual surface stresses caused by grinding in polycrystalline Al₂O₃