Thermodynamic analysis of aluminate formation at Fe/Al2O3 and Cu/Al2O3 interfaces
References (30)
- et al.
Acta metall. mater.
(1991) - et al.
Acta metall.
(1953) - et al.
J. Mater. Sci.
(1989) J. Am. Ceram. Soc.
(1989)- et al.
Arch. Eisenhu¨ttenwes
(1956) - et al.
J. Am. Ceram. Soc.
(1956) - et al.
J. Am. Ceram. Soc.
(1958) - et al.
J. Am. Ceram. Soc.
(1960) Akad. nauk SSSR Isvest. Otd. Tekh. Met. i Toplivo
(1962)
Akad. nauk SSSR Isvest. Otd. Tekh. Met. i Gornoe Delo
Russ. J. Phys. Chem.
J. Iron Steel Inst.
Russ. Metall.
Z. Physik. Chem. N.F.
Cited by (56)
Calculated phase diagrams and thermodynamic properties of the Al<inf>2</inf>O<inf>3</inf>-Fe<inf>2</inf>O<inf>3</inf>-FeO system
2016, Journal of Alloys and CompoundsCitation Excerpt :In the binary system, the solubility of oxygen in solid and liquid iron is very small. In the ternary system, Trumble [12] evaluated the oxygen concentration in FCC phase at 951–1350 °C and in liquid metallic iron at 1550–1700 °C. The results show that the oxygen solubility in both phases is not high in the ternary system.
An in situ X-ray diffraction study of phase separation in Cu-Ta alloy thin films
2016, Thin Solid FilmsEutectic bonding of copper to ceramics for thermal dissipation applications - A review
2014, Journal of the European Ceramic SocietyMicrostructure-thermal properties of Cu/Al <inf>2</inf>O <inf>3</inf> bilayer prepared by direct bonding
2013, Journal of the European Ceramic SocietyCitation Excerpt :Thermodynamic analysis of the formation of the reaction phase at the Cu–Al2O3 interface has been previously conducted.17,18,22,23 These studies indicated that a CuAlO2 reaction phase would be formed between Cu and Al2O3 at 1000 °C, as long as the oxygen solute (O) content of the solid Cu was higher than 1/3–1/6 solubility (0.01–0.005 at%).17 The reaction equation was proposed as following:2Cu(s) + O(s) + Al2O3(s) = 2CuAlO2(s)The case investigated by Trumble et al. is a reaction involving only solid states.
Synthesis and characterization of copper-alumina metal matrix composite by conventional and spark plasma sintering
2012, Journal of Alloys and CompoundsCitation Excerpt :It is desirable to remove cuprous oxides from the interface of Cu–Al2O3 composite to enhance mechanical properties. This fact can be attributed to the high bond strength of Cu/Al2O3 than those of Cu2O/Al2O3 and Cu/Cu2O [15,22,23]. This could possibly be attributed to the formation of cuprous oxide at low temperatures (tentatively 700 °C) and the possibility of onset of decomposition at higher temperatures close to 1000 °C.
Orientation relationships of copper crystals on c-plane sapphire
2011, Acta MaterialiaCitation Excerpt :However, we emphasize that under the conditions of oxygen partial pressure and temperature in which the samples were prepared none of the mixed oxides (CuAlO2 or CuAlO4) can form at the interface. Indeed, at the temperature of our experiments these aluminates are stable only at an oxygen partial pressure higher than 7.2 × 10−8 atm [13]. Fig. 2a and b presents scanning electron microscopy (SEM) (JEOL, JMS-6320F) plan view micrographs of the copper particles.
- †
Present address: School of Materials Engineering, Purdue University, West Lafayette, IN 47907, U.S.A.