Impedance investigation of the mechanism of copper electrodeposition from acidic perchlorate electrolyte
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An experimental study of copper electroplating by electrochemical impedance spectroscopy (EIS) at room temperature
2022, Materials Today: ProceedingsCitation Excerpt :In case of copper electroplating from an acidic bath, the reactions occur at the surface of working electrode where the discharge of Cu and the evolution of hydrogen gas [4]. However, some authors are explaining about the electrodeposition technique still there is a gap in the mechanism of redox reaction [5–14]. Recently C. Gabrielli et.al reported that copper electrodeposition from a chloride-sulphate bath however, individual sulphate bath has not been studied.
Influence of ionic strength on hydrogen generation during interaction of copper with deoxygenated neutral solution
2021, Corrosion ScienceCitation Excerpt :No effect of perchlorate on the initial stages of hydroxide adsorption and Cu2O formation in alkaline solutions was detected [28]. Only the mechanism of Cu deposition from acidic perchlorate solutions was studied in more detail [29,30] and no coupling of perchlorate reduction with processes involving copper was observed [30]. Within the frames of this study, measurements of the open-circuit potential, Cu(II) and H2 concentrations, as well as impedance spectra for up to 168 h in solutions in a wide range of perchlorate concentrations (namely, 0.001−0.1 mol dm−3) were performed at 22–70 °C to quantify the effect of ionic strength and temperature on copper interaction with aqueous electrolytes and the associated hydrogen production rates.
Corrosion inhibition of mild steel by N(4)-substituted thiosemicarbazone in hydrochloric acid media
2017, Egyptian Journal of PetroleumCitation Excerpt :Organic compounds containing electronegative functional groups and π e− systems are usually good inhibitors of corrosion for many alloys and metals in corrosive environment. These organic systems can be adsorbed on the surface of the metal through the hetero atoms such as nitrogen, oxygen and sulfur [5–8]. The structure and properties of the inhibitor molecule such as functional groups, steric factor, molecular size, molecular weight, molecular structure, aromaticity, electron density of the donor atoms and π-orbital character of donating electrons affect the adsorption of corrosion inhibitor on metal surface [9–13].
Corrosion inhibition properties of 1,2,4-Hetrocyclic Systems: Electrochemical, theoretical and Monte Carlo simulation studies
2017, Egyptian Journal of PetroleumCitation Excerpt :The study of corrosion processes and their inhibition by organic compounds is an active field of contemporary research [1–5]. Recently computational quantum chemical calculations and molecular simulation studies have also been used to explain the mechanism of corrosion inhibition [6–12]. The geometry of the inhibitor molecule in its ground state and the nature of their molecular orbitals (HOMO; Highest Occupied Molecular Orbital and LUMO; Lowest Unoccupied Molecular Orbital) are directly involved in the inhibitive properties of these molecules.
The description of the copper deposition/dissolution process in ammonia buffer with the application of mathematical two-plate model
2014, Electrochimica ActaCitation Excerpt :Such a system with two diffusion cathodic peaks and two anodic (adsorption and diffusion) peaks, is appropriate especially for estimation of kinetic parameters. Mechanism aspects of Cu2+ electroreduction process were investigated by several authors mainly in the sixties e.g. [13–17] and they were followed by a number of authors ([18–26] and literature therein). A characteristic type of cyclic voltammetry (CV) response is often met in deposition of metals.