Elsevier

Acta Materialia

Volume 58, Issue 15, September 2010, Pages 5196-5205
Acta Materialia

Dependence of strain rate sensitivity upon deformed microstructures in nanocrystalline Cu

https://doi.org/10.1016/j.actamat.2010.05.055Get rights and content

Abstract

The creep behavior of nanocrystalline copper was experimentally characterized with nanoindentation using two sequential regimes, i.e., loading and holding. Significantly enhanced strain rate sensitivity was found within an unusually narrow range of creep rate in the holding regime, which is attributed to the deformed microstructure generated during the loading regime. By quantitatively analyzing the creep rate and rate sensitivity exponent of NC Cu in the holding regime, both the grain boundary sliding (GBS) and dislocation activities are found to be responsible for the observed abnormal behavior, with the contribution of GBS decreasing with increasing grain size and increasing with decreasing loading strain rate. These findings provide a potential way of adjusting the mechanical properties of nanocrystalline metals by pre-straining.

Introduction

The nanoscale grain size in nanocrystalline (NC) metals results in plastic deformation mechanisms that are substantially different from those in coarse-grained (CG) metals. Additionally, the confined nanoscale grain structure plays an important role in the mechanical properties of NC metals [1], [2]. It has been demonstrated that molecular-dynamics (MD) simulations, which can reflect the effects of both grain size and grain structure, are effective for in situ analysis of the deformation mechanisms of NC metals at atomic level [3], [4], [5], [6]. However, MD simulation can only capture the very beginning of the deformation process owing to its sub-nanosecond time scale [1]. Its generalization to real deformation processes should be considered with discretion [2], and the findings derived from MD simulations need to be validated with experiment measurements. In practice, it is not an easy task to control the grain structures in NC metals. The confined grain structure and the large volume fraction of the grain boundary (GB) make the interplay between GB and dislocation more complicated, and hence highlighting the intricate interplay of the microstructures in the lab environment is difficult. As a result, in general, the grain size has been proposed as the sole key parameter to characterize the mechanical properties of NC metals, although it is known that this is a less effective way than originally expected.

Such simplifications would, in some cases, give rise to uncertainties and controversies. For a CG metal, the grain size dependence of its hardness is consistent with the classical Hall–Petch (H–P) law. When the grain size is reduced to below a critical value at nanoscale, both experiments and MD simulations have revealed that the H–P relation breaks down, with GB activities dominating the plastic deformation [1], [7], [8]. To understand the transition of deformation mechanism associated with varying grain size, considerable efforts have been made to explore quantitatively the critical grain size. Nonetheless, controversies still persist. With NC Cu as an example, MD simulations predict that GB activities will dominate the plastic deformation when the grain size is less than ∼10–15 nm [9]. However, existing experimental studies only show a plausible trend of hardness when the grain size approaches the predicted critical value [10]. Moreover, the H–P law was found to persist even when the grain size was reduced to 10 nm [11]. Besides this discrepancy between experiments and predictions, the MD simulation itself also results in inconsistent findings. A recent MD simulation predicted that dislocations could contribute ∼50% of the plastic strain in Cu with a grain size of 5 nm [12], which is much smaller than the well-documented predictions of the critical grain size of Cu [9], [13].

Other than MD simulations, transmission electron microscopy (TEM) is another effective technique for evaluating the evolution of microstructures during deformation [14], [15], [16], [17]. This, however, also has some uncertainties. For in situ TEM study of ultra-thin TEM foils, the observation may be hindered by enhanced diffusion from nearby free surfaces, leading to possible wrong interpretations of the observed diffraction contrast [7]. Ex situ TEM observations, in contrast, may be flawed by stress relaxation during specimen preparation. Furthermore, as the ex situ TEM can only reveal the final state of the deformation, understanding the entire deformation process is difficult. Accordingly, the link between the confined nanoscale grain structure and the mechanical properties has remained open in NC metals.

Given that GB acts as both a source and a sink for dislocations that extend throughout the entire grain in NC metals [1], [2], Carlton and Ferreira [10] recently proposed a model for the inverse H–P effect, with a new parameter, the probability of a dislocation absorbed by the GB, introduced. This model potentially demonstrates a way to describe the local grain structure environment and stressing state during deformation. Based on Carlton’s work, the present authors propose that a test consisting of two sequential deformation processes might be able to uncover the link between the internal grain structures of a NC metal and its mechanical properties. While the first process sets up an environment for various deformed microstructures to evolve, the following one aims to demonstrate the features of the deformed microstructures generated during the preceding process. To this end, nanoindentation creep is considered a suitable testing method. In the present study, the nanoindentation creep test has two separate regimes: the loading regime in which the load is continuously increased, and the holding regime in which the load remains constant. For the loading regime, Carlton’s model can be adopted, in which the ability to absorb dislocations is changed by varying the loading strain rate (LSR). For the holding regime, as the extended dislocations will be trapped inside a nanoscale grain under very high stresses [18], the giga-pascal level stresses induced by the stabilized stresses underneath the nanoscale indenter prevent the emitted dislocations from running back to where they originally nucleate. Furthermore, as both the emission and absorption processes can alter the grain structures by influencing the local GB and dislocation networks in NC metals [3], [4], [5], [6], the deformed microstructures generated in the loading regime can be demonstrated by examining the creep behavior in the holding regime.

In the present experimental study, the loading regime is employed as a pre-straining process to generate different deformed microstructures at different LSR, and the holding regime is designed to validate the proposed model. The strain rate dependence of the hardness and creep behavior of NC Cu is quantified to explore the link between its deformed microstructure and mechanical response.

Section snippets

Specimen preparation and grain size evaluation

Two NC Cu specimens with different grain sizes were tested. One is a Cu film (2.5 μm thick) deposited on a single Si (1 1 1) substrate by means of magnetron sputtering. In order for the film to have a sufficiently small grain size, short depositions were conducted several hundreds of times at intervals of 60 s to minimize the growth of columnar grains, as described in Ref. [19]. The other specimen is a Cu coating synthesized using the brush-plated technique detailed in Ref. [20]. For reference, a

Results

Three sets of representative load–displacement (ph) curves obtained with different LSR are shown in Fig. 3. The curves of CG Cu (Fig. 3a) overlap substantially, suggesting that its mechanical response exhibits negligible small rate sensitivity. In contrast, the curves of the two NC Cu specimens show experimentally detectable discrepancies, as a higher indentation load is required to reach the same displacement at a larger LSR. This observation is consistent with previous findings on NC Ni and

Discussion

When the grain size is reduced to nanoscale, the volume fractions of GB, triple junctions and intercrystalline defects increase, so that GB-mediated mechanisms, i.e., GBS [31] and Coble creep [32], become more active. As a higher rate sensitivity is expected to involve more GB activities, the high mcreep of NC Cu may be attributed to the large enhancement of GBS and/or Coble creep mechanisms [7], [33]. Consequently, the dominant mechanism in the holding regime is discussed first.

Conclusions

Based on the present experimental study, one can conclude that the creep deformation of NC Cu is strongly dependent on the type of loading applied, which can result in different initial GB structures during deformation. The variations in the deformed microstructures of NC Cu during the loading regime lead to unusually high rate sensitivity of the material in the subsequent holding regime, at an unexpected narrow range of creep rate. By quantitatively analyzing the creep rate and rate

Acknowledgements

The authors wish to thank Prof. Z.H. Jiang for providing the brush-plated Cu specimen. This work was supported by the National Basic Research Program of China (2010CB631002, 2006CB601201), the National Natural Science Foundation of China (50501019, 50701034, 10825210), the National 111 Project of China (B06024), Program for New Century Excellent Talents in University NCET-07-0665 and the Fundamental Research Funds for the Central Universities.

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