Full Length ArticleNanocharacterization of the adhesion effect and bending stiffness in optical MEMS
Introduction
Nowadays, the current trend is to combine sensors, actuators and the electrical interface on the same chip in order to obtain a functional system usually called Microelectromechanical Systems – MEMS [1].
This is useful implemented in many day-to-day applications such as vibrational sensors, in-car insurance sensors, lab-on-chip from medical applications, seismic sensors and so on.
The goal of optical MEMS is to integrate into a single device the mechanical, electrical and optical properties. One of the MEMS applications in optical systems are communication networks, optical white light interferometry, displays of mobile phones, variable optical attenuators, optical spectrometers or bar code readers. The MEMS components from optical applications are designed to have high mobility and to be less sensitive to a thermal gradient. These functional characteristics depend on stiffness that is given by the geometrical configuration of structure and is influenced by the material behaviour.
The scope of research work presented in this paper is the reliability design and testing of flexible MEMS components as clamp-clamp beams for the out-of-plane displacement considering different thermal gradients applied on structures. The field of implementation of such structures is in the optical relevant applications such as the optical microsensors or optical microswitches where an additional prestress is provided by a thermal gradient.
Among the main causes of failure of these microstructures are excessive tension that occurs due to bending effect and stiction. Stiction is one of the most important and inevitable problems of microbridges failure under large deflections [2]. Stiction means that the two structures are bonded to each other, never apart in controlled or unintentionally into contact with each other [3]. This phenomenon of stiction is crucial in small sizes structure, because it is caused by interfacial forces relatively high compared to the restoring force. The control of these opposite forces is therefore crucial. Since the reduction of interfacial force is done by mainly chemical processing [4], the control of the contact area and surfaces conditions are important for stiction [5].
Although a lot of mechanical reliability assessments have been conducted, it is difficult to discuss general theory about the reliability of MEMS components, because all the assessments are made by various methods and conditions. Most often, the operating temperature of the MEMS components as microbridges, microcantilevers or micromembranes can be significantly higher than the ambient temperature. In these conditions the temperature introduces in microstructures a residual stress and additionally deforms the microcomponents with an influence on the mechanical response of the system. In other, to integrate the microbridges in a MEMS device with high reliability it is necessary to determine the real stiffness of the flexible structure. The microbridge stiffness is closely linked to the material properties and is influenced by geometric characteristics of the structure.
Specialized literature includes biaxial stress analysis on characterizing microbridges with rectangular and circular geometry and analysis of elastic modulus of homogeneous structure [2], [6], [7], [8]. The static investigations of the micromembranes with measurement of their load – deflection behaviour have been already reported [9], [10]. Finite element analysis (FEA) is a very useful tool to simulate microbridges deformation, to calculate the stiffness and to view the stress distribution in samples [11]. Currently, MEMS researchers do not have enough information to predict the output responses of flexible MEMS microstructures and intense efforts should focus in this respect [9], [12], [13].
In this work the analytical formula to compute the microbridges stiffness as a function of the geometrical parameters is provided in Section 2 of paper. The numerical analysis of microbridges stiffness was performed at different temperatures by the thermo-mechanical module of ANSYS Workbench 13 Software as it is presented in Section 3 of paper. The experimental investigations of microbridges deflections under a mechanical force performed by using an atomic force microscope (AFM) in order to measure the stiffness of samples are included in Section 4 of paper. This section also presents the pull-off force measurements between the flexible part of microbridges and substrate as well as the temperature influence on stiffness and adhesion. The results and discussions are presented in Section 5. The paper is ended with important conclusions as including in Section 6 of paper.
Scientific and experimental details for each evaluation were very different because the reasons for those evaluations are geared toward direct interest of each researcher such as: product development, materials science, etc. The research results obtained in this paper are useful for designers to predict the behaviour of material and structure from optical application and to increase the MEMS lifetime.
Section snippets
Theoretical approach
The samples under investigations are microbridges with different geometrical configurations. To get a variable stiffness and thermal behaviour the geometry of microbridge has been modified by cutting out rectangular areas symmetrically placed about the symmetry planes as presented in Fig. 1. Two cases have higher practical relevance: one having the rectangular holes placed closed to the anchors and other having them near the middle of the microbridge. Varying the length of the rectangular holes
Numerical analysis of microbridges bending stiffness
A numerical analysis of microbridges stiffness was performed by Finite Element (FE) method using the thermo-mechanical module in ANSYS Workbench 13 software. The mesh of the FEA model consists of around 84,000 hexahedral elements with a size of 2 μm. For appropriate boundary conditions and results both the microbridges and the substrate has been modelled. The substrate is normal constraint on the lower surface and only elements corresponding to a very small area around the symmetry point of the
Experimental investigations
This section presents the experimental tests performed by using an atomic force microscope (AFM) in order to measure the out-of-plane stiffness of investigated samples fabricated in different geometrical configurations and the pull-off forces between the microbridges and their substrate. The experimental investigations were done at Technical University of Cluj-Napoca in the Micro and Nano- System Laboratory using an AFM XE 70 from Park System Co.
As the geometry of investigated microbridges
Results and discussions
The numerical analysis and experimental tests were performed with a force applied in the mid-position of microbridges mobile plate. During experimental tests, the humidity of the testing condition is constantly kept to 40%RH and the temperature applied directly on substrate is increased from 20 °C to 100 °C. In order to avoid the temperature effect on the AFM probe, the probe is retracted to its initial position during increasing of temperature. Initially, using the AFM dynamic mode, the AFM
Conclusions
The mechanical characteristics of microbridges have influence on their reliability design. Depending on their application, different sensitivity of microbridges can be obtained by changing the geometrical configuration of the flexible plate. The effect of geometrical configuration on gold microbridges is analyzed in this paper. The scope is to observe the temperature effect on samples stiffness. The experimental results performed by AFM were validated by numerical analysis. Moreover, the
Acknowledgments
This work was supported by a grant of the Romanian National Authority for Scientific Research and Innovation, CNCS-UEFISCDI, project number PN-II-RU-TE-2014-4-1271.
References (16)
Mechanical and tribological properties of thin films under changes of temperature conditions
Surf. Coat. Technol.
(2015)3D measurement of micromechanical devices vibration mode shapes with a stroboscopic interferometric microscope
Opt. Laser. Eng.
(2001)Analysis of the surface effects on adhesion in MEMS structures
Appl. Surf. Sci.
(2015)Micro System Technologies 90
(1990)- et al.
Static response and stiction analysis of MEMS micromembranes for optical applications
Phys. Status Solidi (c)
(2015) - et al.
Surface chemistry and tribology of MEMS
Annu. Rev. Phys. Chem.
(2004) Reliability of MEMS: Testing of Materials and Devices
(2013)- et al.
Thin‐film modeling for mechanical measurements: should membranes be used or plates?
J. Appl. Phys.
(1992)
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