Characterisation of PMMA microfluidic channels and devices fabricated by hot embossing and sealed by direct bonding
Introduction
The basic requirements for microfluidic devices commercialization are economical fabrication, large scale production and good sensitivity. Microfluidic devices based on silicon, glass, quartz and plastic has been widely studied in the past ten years. The silicon and glass-based material often induces problems, such as lack of optical clarity, low impact strength and poor-compatibility, thus limiting its widespread usage in microfluidic devices. On the other hand, the importance of micro-structures on polymers is increasing, particularly when considered as a low-cost alternative to the silicon- or glass-based MEMS technologies, for single-use disposable biomedical sensors. Additionally, polymer-based materials offer a wide range of physical and chemical properties, such as low electrical conductivity and high chemical stability. In recent years, many polymer-based microfabrication techniques [1] via microinjection molding [2], [3], casting [4], [5], and micro-hot embossing [6], [7] have been developed.
In polymer-based microfabrication techniques, microinjection molding is most popular and generally used for micromolding in the industry. However, compared to the microinjection molding, hot embossing provides several advantages such as a relatively low-cost for embossing tools, simple operation and higher accuracy in the replication of small features. The hot embossing process introduces less residual stress in the polymer because the polymer stretches for a very short distance from the substrate into micro-structure during hot embossing. As a result, the molded parts are well suited for optical components. In addition, the temperature variation range for the polymer is smaller than that required in injection molding, thus can reduce shrinkage during cooling and the friction forces acting on the microfeatures during de-molding. Hot embossing includes several steps and details have been reported elsewhere [1]. The embossing master stamp can be a silicon wafer, glass, electroplated nickel mold or other stamp with microfeatures. Still, micro-hot embossing is facing challenge in terms of process feasibility, since it is difficult to make the polymer to fill completely into microfeatured geometry of high aspect ratio and it is also delicate to separate the embossed structures from the mold without breakage.
In this paper, the correlation between the dimensions of the master stamps features and the corresponding replicated features was analysed along with the fluid flow behaviour in the channel. The bonding between microfluidic structures and lids was leak-tested was carried on these devices by flowing colored dye.
Section snippets
Microchannel stamp fabrication
The maskless UV lithographic technique was employed for the production of the micro-structured stamp. In this study, the SU-8 (SU-8 is a photopatternable epoxy resin) micro-structures were fabricated on a 4 inches silicon wafer. The SU-8 is a viscous and adhesive substance commonly used in lithographic process to create well-defined and stiff pattern. Prior to fabrication the silicon substrate is cleaned first with piranha solution (H2SO4 + H2O2) and then with acetone and de-ionized water before
Results and discussion
Maskless UV lithography was used to produce micro-structured stamp based on SU-8 photoresist coated on silicon substrate. The microfeature in the silicon stamp includes microchannel arrays of approximately 30 μm in depth and 5 mm in length. The stamp contains various channels without pillars, as well as with SU-8 pillars in the range of 50–100 μm wide and 10 μm in height. PMMA discs of 4 inches diameter and 1 mm thickness were utilized as the molding substrate. One PMMA disc can accommodate at least
Conclusion
In this study, novel microchannel device fabrication process was demonstrated in which a microchannel was formed by hot embossing on PMMA discs and directly bonded with the PMMA lid. It was confirmed by the experiments that the microchannel is suitable for fluid flow without any leak. The transient evolution of meniscus front is experimentally visualized using optical microscope for DI water.
References (12)
Microelectronic Engineering
(1997)- et al.
Current Opinion in Chemical Biology
(1997) - et al.
Journal of Micromechanics and Microengineering
(2004) - et al.
Analytical Chemistry
(1997) - et al.
Polymer News
(2000) - et al.
Analytical Chemistry
(1998)
Cited by (84)
Microfluidic device based molecular Self-Assembly structures
2022, Journal of Molecular LiquidsA new RT-LAMP-on-a-Chip Instrument for SARS-CoV-2 diagnostics
2022, Microchemical JournalCitation Excerpt :The ablation process has the disadvantage of generating high roughness of the surface, which can reduce the applicability for some devices [19]. There are different methods for sealing PMMA chips, such as solvent bonding, chemical bonding, adhesive bonding, and thermal bonding [20]. Thermal bonding is also a commonly used method for manufacturing PMMA chips, allowing a simple and uniform surface bonding, however, this method may lead to channel deformation [21].
Rapid assembly of PMMA microfluidic devices with PETE membranes for studying the endothelium
2022, Sensors and Actuators B: ChemicalCitation Excerpt :Laser cutting also benefits from being maskless, can rapidly turn around designs, and does not require any milling tools, but is limited with regard to cut profile: it can only create V-shaped grooves or through cuts, and depending on the plastic can often encounter issues with meltback [31,32]. To seal and create enclosed microfluidic devices, multiple methods [38] have been developed including solvent bonding [39], liquid adhesives, two-sided tape [40], thermal bonding (hot pressing, laser welding, ultrasonic welding) [41], and surface functionalization (plasma, vapor, or liquid chemistry) [42] or a combination of these [43]. While these bonding methods work well for microfluidic chips made from a single material, some systems require more than one material, and challenges exist for bonding dissimilar thermoplastic materials.
Investigation of replication accuracy of embossed micro-channel through hot embossing using laser patterned copper mold
2022, Materials Today: ProceedingsMicrofluidic study of sustainable gold leaching using glycine solution
2019, HydrometallurgyOrgans-on-a-chip engineering
2019, Organ-on-a-chip: Engineered Microenvironments for Safety and Efficacy Testing