Stabilization of hexagonal Cu6(Sn,Zn)5 by minor Zn doping of Sn-based solder joints
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Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer
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2022, Journal of Alloys and CompoundsCitation Excerpt :Various metals, such as Ni, Au, In, and Zn, have been widely explored as the third elements for Cu–Sn SLID bonding systems to stabilize the high-temperature hexagonal ƞ-Cu6Sn5 phase. Furthermore, elements such as Zn and Ni can suppress the Cu3Sn phase formation and subsequently void formation [9,14–23]. Regarding the wafer-level packaging of MEMS devices, typical process integration challenges are related to the chemical/electrochemical plating processes for the SLID interconnection materials without negatively impacting the sensitive MEMS structures or vice versa.
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2019, Journal of Alloys and CompoundsMicrostructure and properties of Cu-Sn-Zn-TiO<inf>2</inf> nano-composite coatings on mild steel
2018, Surface and Coatings TechnologyCitation Excerpt :Copper‑tin‑zinc (Cu-Sn-Zn) ternary alloy has attracted tremendous research interests due to its unique properties, including gorgeous color, high corrosion resistance [1,2], remarkable solder ability [3–6] and good electrical conductivity. Cu-Sn-Zn alloys have been fabricated by different methods, such as melting [7–10], powder metallurgy [11] and electrodeposition [12–15]. Among these methods, electrodeposition is an effective method to fabricate Cu-Sn-Zn coatings [16] because of its simple process and high environment adaptability.