Thermally stable Cu3Sn/Cu composite joint for high-temperature power device

doi:10.1016/j.scriptamat.2015.08.011

Scripta Materialia

Volume 110, 1 January 2016, Pages 101-104

https://doi.org/10.1016/j.scriptamat.2015.08.011 Get rights and content

Abstract

This paper describes a novel transient liquid phase sinter (TLPS) bonding that utilizes Sn-coated micro-sized Cu particles for high-temperature power device packaging. When used as die attach materials for Cu–Cu bonding, a thermally stable joint comprising a Cu₃Sn intermetallic compounds (IMCs) with a dispersion of ductile Cu particles was obtained after bonding at 300 °C for 30 s, and a shear strength equivalent to that of conventional Pb–5Sn solder could be achieved. After isothermal aging at 300 °C for 200 h, the shear strength and microstructure of the bonding joints were almost unchanged.

Graphical abstract

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Thermally stable Cu3Sn/Cu composite joint for high-temperature power device

Abstract

Graphical abstract

Acta Mater.

Acta Mater.

Acta Mater.

Electrochim. Acta

Mater. Sci. Eng. R

Acta Mater.

Thermally stable Cu₃Sn/Cu composite joint for high-temperature power device