Skip to main content
Log in

Intergranular Stress Corrosion Cracking of Pure Copper 〈111〉 Tilt Bicrystals

  • Published:
Interface Science

Abstract

Behaviour of stress corrosion cracking (SCC) in a series of pure copper bicrystals with a symmetrical 〈111〉-tilt boundary has been investigated. Tests were performed by the slow strain rate technique (SSRT) in 1M NaNO2 solutions. The small-angle tilt bicrystals fractured in both intergranular and transgranular manners accompanied by a large amount of plastic strain to fracture while the large-angle bicrystals fractured in almost intergranular manner with a smaller plastic strain. Susceptibility of SCC increases with increasing misorientation and becomes relatively constant in large-angle grain boundaries. The local minima appeared at the Σ7(321) and Σ3(211) boundaries, suggesting that the susceptibility was partially affected by grain boundary energy. Stress concentration generated by the pile-up of trapped dislocations at the grain boundary could account for the high susceptibility of the intergranular SCC in large-angle grain boundaries.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. M. Yamashita, T. Mimaki, S. Hashimoto, and S. Miura, Phil. Mag, A 63, 707 (1991).

    Google Scholar 

  2. A. Roy, U. Erb, and H. Gleiter, Acta Metall. 30, 1847 (1982).

    Google Scholar 

  3. Y. Pan, B.L. Adams, T. Olson, and N. Panayotou, Acta Mater. 44, 4685 (1996).

    Google Scholar 

  4. K.T. Aust, U. Erb, and G. Palumbo, Mater. Sci. Eng. A 176, 329 (1994).

    Google Scholar 

  5. D.C. Crawford and G.S. Was, Metall. Trans. 23A, 1195 (1992).

    Google Scholar 

  6. S.P. Pednekar, A.K. Agrawal, H.E. Chaung, and R.W. Staehle, J. Electrochem. Soc. 126, 701 (1979).

    Google Scholar 

  7. T. Mimaki, Y. Nakazawa, S. Hashimoto, and S. Miura, Metall. Trans. 21A, 2355 (1990).

    Google Scholar 

  8. T. Mimaki, M. Yamashita, S. Hashimoto, and S. Miura, in Proc. 6th Int. Conf. on Mechanical Behaviour Materials-VI, Kyoto, edited by M. Jono and T. Inoue (Pergamon Press, 1991), p. 663.

  9. G.-J. Wang and V. Vitek, Acta Metall. 34, 951 (1986).

    Google Scholar 

  10. H. Vehoff, H. Stenzel, and P. Neuman, Z. Metallkunde 78, 550 (1987).

    Google Scholar 

  11. T. Mimaki, H. Ando, H. Miyamoto, Y. Kaneko, and S. Hashimoto, Mater. Sci. Forum 294-296, 169 (1999).

    Google Scholar 

  12. W. Liu, M. Bayerlein, H. Mughrabi, A. Day, and P.N. Quested, Acta Metall. Mater. 40, 1763 (1992).

    Google Scholar 

  13. A.N. Stroh, Proc. Roy. Soc. A223, 404 (1954).

    Google Scholar 

  14. M. Yamashita, K. Shimazaki, and T. Mimaki, Sci. Eng. Rev. Doshisha Univ. 34, 1 (1993).

    Google Scholar 

  15. J. Yu and R.N. Parkins, Corrosion Sci. 27, 159 (1987).

    Google Scholar 

  16. E. Escalante and J. Krugar, J. Electrochem. Soc. 118, 1062 (1971).

    Google Scholar 

  17. W.J. Flanagan, P. Bastlas, and B.D. Lichter, Acta Mater. 39, 695 (1991).

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

About this article

Cite this article

Miyamoto, H., Koga, H., Mimaki, T. et al. Intergranular Stress Corrosion Cracking of Pure Copper 〈111〉 Tilt Bicrystals. Interface Science 9, 281–286 (2001). https://doi.org/10.1023/A:1015167030009

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1023/A:1015167030009

Navigation