Abstract
Differential scanning calorimetry (DSC) was used to compare the thermal curing of two adhesives suitable for using in the manufacture of exterior-grade plywood boards: a commercial phenol-formaldehyde (PF) resin, and a tannin-phenol-formaldehyde (TPF) resin developed in our laboratory. The experimental curves were well simulated by means of the Model Free Kinetics isoconversional method incorporated in the Mettler-Toledo STARe software package. The corresponding kinetic calculations predict that the TPF resin cures faster than the PF resin. This finding implies the possibility that the TPF resin may allow the achievement of higher productivity by permitting the use of shorter press times than with conventional PF resins.
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Vázquez, G., González-Álvarez, J., López-Suevos, F. et al. Curing Kinetics Of Tannin-Phenol-Formal- dehyde Adhesives As Determined By DSC. Journal of Thermal Analysis and Calorimetry 70, 19–28 (2002). https://doi.org/10.1023/A:1020680928311
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DOI: https://doi.org/10.1023/A:1020680928311